Soldering paste
7112 |
Soldering paste 100g Medium-active flux that facilitates soldering of the following elements: copper, silver-plated, zinc-coated and nickel-plated, used in the places where rosin is not sufficient. |
7111 |
Soldering paste 35g Medium-active flux that facilitates soldering of the following elements: copper, silver-plated, zinc-coated and nickel-plated, used in the places where rosin is not sufficient. |
13875 |
Thermally Conductive Adhesive Termoglue - 10g Thermally Conductive Adhesive Termoglue - 10g a great way to secure the radiators to e.g. memory chips, transistors or bridges. The connection thus created is super strong and has excellent heat transfer characteristic. |
7114 |
Tinsulating silicone paste "N" 3,5g Tinsulating silicone paste "N" 3,5g Insulates, protects against weathering, prevents from breakdowns, preserves rubber, plastics, features a wide range of operating temperatures: from –50°C to 200°C, good chemical resistance to oxidation, water solutions of acids, bases, sulfur dioxide, ammonia. |
7115 |
Tinsulating silicone paste "N" 60g Tinsulating silicone paste "N" 60g Insulates, protects against weathering, prevents from breakdowns, preserves rubber, plastics, features a wide range of operating temperatures: from –50°C to 200°C, good chemical resistance to oxidation, water solutions of acids, bases, sulfur dioxide, ammonia. |
22026 |
Low-Melting solder paste Mechanics MCN B80-BS458 - Sn42/Bi58- 60g Low-Melting solder paste Mechanics MCN B80-BS458 - Sn42/Bi58- 60g is a special type of low melting solder paste (tin in the form of paste) designed for soldering SMD / BGA elements in repair processes / data recovery. Thanks to a very low melting point of 138C, it enables complex repairs (eg, inserting a CPU in the iPhone) without exposing the other components of the phone to damage. |
22027 |
Low-Melting solder paste Mechanics MCN WQ80 - Sn42 / Bi58 + PB- 40g Low-Melting solder paste Mechanics MCN WQ80 - Sn42 / Bi58 + PB- 40g is a special type of low melting solder paste (tin in the form of paste) designed for soldering SMD / BGA elements in repair processes / data recovery. Thanks to a very low melting point of 138C, it enables complex repairs (eg, inserting a CPU in the iPhone) without exposing the other components of the phone to damage. |
1374 |
Solder paste AP-10, SN62, 35g it's special paste that will help you to solder SMD, BGA chipset or even SMT elements. |
1044 |
Solder paste BAKU BK-30G 0,03 kg Solder paste BAKU BK-30G 0,03 kg |
7012 |
Solder paste BAKU BK-5063 0,05 kg Solder paste BAKU BK-5063 0,05 kg |
7013 |
Solder paste Mechanic BGA 0,03 kg Solder paste Mechanic BGA 0,03 kg |
7113 |
Soldering paste 1000g Medium-active flux that facilitates soldering of the following elements: copper, silver-plated, zinc-coated and nickel-plated, used in the places where rosin is not sufficient. |
7758 |
Solder paste Omnix, 40g it's special paste that will help you to solder SMD, BGA chipset or even SMT elements. Composition: 62Sn/36Pb/2Ag |