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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit

Stencil BGA kit

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AMAOE BGA stencil reballing Mbga-U13 MSM8996 MSM8953 1AB, MSM8974 for MBGA-B6
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22985

AMAOE BGA stencil reballing Mbga-U13 MSM8996 MSM8953 1AB, MSM8974 for MBGA-B6

AMAOE BGA stencil reballing Mbga-U13 MSM8996 MSM8953 1AB, MSM8974 for MBGA-B6 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

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Price: 7.00 EUR w/o VAT
AMAOE BGA stencil reballing Mbga-U14 BGA CPU RAM256 RAM366 0.12mm
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22996

AMAOE BGA stencil reballing Mbga-U14 BGA CPU RAM256 RAM366 0.12mm

AMAOE BGA stencil reballing Mbga-U14 BGA CPU RAM256 RAM366 0.12mm - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

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Price: 7.00 EUR w/o VAT
AMAOE BGA stencil reballing Mbga-U2
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22974

AMAOE BGA stencil reballing Mbga-U2

AMAOE BGA stencil reballing Mbga-U2 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

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Price: 7.00 EUR w/o VAT
AMAOE BGA stencil reballing Mbga-U3
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22975

AMAOE BGA stencil reballing Mbga-U3

AMAOE BGA stencil reballing Mbga-U3 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

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Price: 7.00 EUR w/o VAT
AMAOE BGA stencil reballing Mbga-U4
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22976

AMAOE BGA stencil reballing Mbga-U4

AMAOE BGA stencil reballing Mbga-U4 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

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Price: 7.00 EUR w/o VAT
AMAOE BGA stencil reballing Mbga-U5 for SM4250/6115, SM6125, SM8150 CPU for Mbga-B5
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22977

AMAOE BGA stencil reballing Mbga-U5 for SM4250/6115, SM6125, SM8150 CPU for Mbga-B5

AMAOE BGA stencil reballing Mbga-U5 for SM4250/6115, SM6125, SM8150 CPU for Mbga-B5- the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

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Price: 7.00 EUR w/o VAT
AMAOE BGA stencil reballing Mbga-U7 for SDM439 MSM8917 RAM556 for Mbga-B5
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22979

AMAOE BGA stencil reballing Mbga-U7 for SDM439 MSM8917 RAM556 for Mbga-B5

AMAOE BGA stencil reballing Mbga-U7 for SDM439 MSM8917 RAM556 for Mbga-B5- the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

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Price: 7.00 EUR w/o VAT
AMAOE BGA stencil reballing Mbga-U8 for SDM660 MSM8937/8940, MT6885Z for Mbga-B5
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22980

AMAOE BGA stencil reballing Mbga-U8 for SDM660 MSM8937/8940, MT6885Z for Mbga-B5

AMAOE BGA stencil reballing Mbga-U8 for SDM660 MSM8937/8940, MT6885Z for Mbga-B5 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

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Price: 7.00 EUR w/o VAT
AMAOE BGA stencil reballing Mbga-U9 for MSM8916/8939 MT6891Z for Mbga-B5
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22981

AMAOE BGA stencil reballing Mbga-U9 for MSM8916/8939 MT6891Z for Mbga-B5

AMAOE BGA stencil reballing Mbga-U9 for MSM8916/8939 MT6891Z for Mbga-B5 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

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Price: 7.00 EUR w/o VAT
BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611
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22850

BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611

BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611 reballing stencil, template, matrix for Samsung Exynos RAM chip repair.

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Price: 6.00 EUR w/o VAT
BGA Stencil for HiSiliconHUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm
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22644

BGA Stencil for HiSiliconHUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm

BGA Stencil for HiSilicon HUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm tin planting solder template for Hisilicon Huawei 6260 3670 3680 BGA reballing stencil.

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Price: 8.00 EUR w/o VAT
BGA Stencil for Samsung Exynos 7880 / 8895B/ 9810/ 3475/ 7580/ 8895A/ 3470/ 7570 CPU-012mm
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22501

BGA Stencil for Samsung Exynos 7880 / 8895B/ 9810/ 3475/ 7580/ 8895A/ 3470/ 7570 CPU-012mm

BGA Stencil for Samsung Exynos 7880 / 8895B/ 9810/ 3475/ 7580/ 8895A/ 3470/ 7570 CPU-012mm the stencil can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Durable in use. High success rate of planting tin.

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Price: 9.00 EUR w/o VAT
MEGA-IDEA Black Stencils Qualcom CPU MSM8998 A B | MSM8953 1AB B01 | MSM8916 |MSM8937
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22485

MEGA-IDEA Black Stencils Qualcom CPU MSM8998 A B | MSM8953 1AB B01 | MSM8916 |MSM8937

MEGA-IDEA Black Stencils Qualcom CPU MSM8998 A B | MSM8953 1AB B01 | MSM8916 |MSM8937- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

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Price: 9.00 EUR w/o VAT
MEGA- IDEA Black Stencils Qualcom PM Power
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22486

MEGA- IDEA Black Stencils Qualcom PM Power

MEGA- IDEA Black Stencils Qualcom PM Power- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

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Price: 9.00 EUR w/o VAT
MEGA-IDEA Black Stencils Qualcom CPU MSM8994 A B |MSM8974 A B |MSM8960 A B
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22487

MEGA-IDEA Black Stencils Qualcom CPU MSM8994 A B |MSM8974 A B |MSM8960 A B

MEGA-IDEA Black Stencils Qualcom CPU MSM8994 A B |MSM8974 A B |MSM8960 A B- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

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Price: 9.00 EUR w/o VAT
MEGA-IDEA Black Stencils MTK CPU
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22488

MEGA-IDEA Black Stencils MTK CPU

MEGA-IDEA Black Stencils MTK CPU- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

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Price: 9.00 EUR w/o VAT
MEGA-IDEA Black Stencils MSM8916 8939 8940 CPU For OPPO VIVO
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22489

MEGA-IDEA Black Stencils MSM8916 8939 8940 CPU For OPPO VIVO

MEGA-IDEA Black Stencils MSM8916 8939 8940 CPU For OPPO VIVO- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

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Price: 9.00 EUR w/o VAT
MEGA-IDEA Black Stencils MSM8916 8928 MT6952 CPU For Redmi NOTE | Redmi 2 |2A
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22490

MEGA-IDEA Black Stencils MSM8916 8928 MT6952 CPU For Redmi NOTE | Redmi 2 |2A

MEGA-IDEA Black Stencils MSM8916 8928 MT6952 CPU For Redmi NOTE | Redmi 2 |2A- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

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Price: 9.00 EUR w/o VAT
MEGA-IDEA Black Stencils MSM8953 MT6797 CPU For Redmi Note 4 | 4X | Redmi Pro
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22491

MEGA-IDEA Black Stencils MSM8953 MT6797 CPU For Redmi Note 4 | 4X | Redmi Pro

MEGA-IDEA Black Stencils MSM8953 MT6797 CPU For Redmi Note 4 | 4X | Redmi Pro- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

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Price: 9.00 EUR w/o VAT
MEGA-IDEA Black Stencils MSM8998 CPU For MI6 Series | MIX 2
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22492

MEGA-IDEA Black Stencils MSM8998 CPU For MI6 Series | MIX 2

MEGA-IDEA Black Stencils MSM8998 CPU For MI6 Series | MIX 2- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

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Price: 9.00 EUR w/o VAT
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