Stencil BGA kit

MEGA- IDEA Black Stencils Qualcom CPU MSM8992 A B | MSM8976 A B | MDM8996 A B- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2 - proffesional builder of black reballing stencils. great ordinarity. economic but functional. With multiple polish and test, all series of reballing tools for apple and adroid phone chips finally come out.

MEGA-IDEA Black Stencils MSM8996 CPU for Galaxy S7 Series|G9300/9350/9308 - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

MEGA-IDEA Black Stencils MT6771/6763/SDM660 For OPPO A3|A1|A73|A79|A83|R11|R15 |VIVO X20|X20i|Y75- is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

MEGA-IDEA Black Stencils MSM8974 8274 8674 CPU for MI4 Series MI3 |3S |NOTE - proffesional builder of black reballing stencils. great ordinarity. economic but functional. With multiple polish and test, all series of reballing tools for apple and adroid phone chips finally come out.

MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9 - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

MEGA-IDEA Black Stencils SDM 660 CPU for Oppo R11 Series|VIVOX20|MI|NOTE3 - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional.

AMAOE BGA Mbga-MB2 stencil reballing BGA Move Board A13 Wifi 0,12mm- the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

QianLi 73 Piece Complete Pack of Reballing Stencils For Phone IC Chip Repair This complete pack of stencils is ideal for any professional phone repair technician wishing to reball chips from a massive range of phones. Also you save money buying a pack this side, rather than individual stencils.

RBX platform set for reballing BGA UFS/eMMc/eMCPis a complete set for cleaning BGA systems and preparing them for reballing. Easy and fast method of placing solder balls on BGAs. RBX includes a set of sieves enabling quick and easy application of balls to BGA eMMC, eMCP and UFS components. Durable design with TecaForm and aluminum alloy makes it easy to remove excess balls. Perfectly matching the templates to the base guarantees full adhesion of the balls to the systems. RBX has been adapted to work with the Jovy iRework water heater. It optimizes work during the whole reballing process.