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Stencil BGA kit
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22898 |
MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X the stepped grooves can quickly adjust the tin sweating location of IC beads, the square hole position makes the tin bead form easier to remove. |
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22289 |
RBX platform set for reballing BGA UFS/eMMc/eMCP RBX platform set for reballing BGA UFS/eMMc/eMCPis a complete set for cleaning BGA systems and preparing them for reballing. Easy and fast method of placing solder balls on BGAs. RBX includes a set of sieves enabling quick and easy application of balls to BGA eMMC, eMCP and UFS components. Durable design with TecaForm and aluminum alloy makes it easy to remove excess balls. Perfectly matching the templates to the base guarantees full adhesion of the balls to the systems. RBX has been adapted to work with the Jovy iRework water heater. It optimizes work during the whole reballing process. |
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658 |
24 stainless paiting ball for making IC Tin ball 24 stainless paiting ball for making IC Tin ball is a needed tool when you have to exchange BGA parts of your phone. |
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8847 |
BGA for iPhone 5 - UD p3012 plaiting kit BGA for iPhone 5 - UD p3012 plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
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8699 |
BGA for SonyEricsson A2 plaiting kit BGA for SonyEricsson A2 plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
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22171 |
BGA MTK MT / MT Power (MT: 2) 0.12mm stencils BGA MTK MT / MT Power (MT: 2) 0.12mm stencils enable reballing: MT6325V, MT6290MA, MT6261MA, MT6322, MT6329, MT6353V, MT6311DP. |
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1784 |
BGA Planting Kit for Siemens series x65, x7x BGA Planting Kit for Siemens series x65, x7x it's proffesional stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone. List of supported phones: A70, A75, AX75, C75, CX75, M75, Siemens CX70, Siemens X65 - np. A65, C65, CV65, CT65, CF65, CX6C, CX65, CXV65, S65, SV65, SL65, M65, MV65 and similar... |
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7512 |
BGA Plate Nokia 09 new model plaiting kit BGA Plate Nokia 09 new model plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
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7513 |
BGA Plate Nokia N97/N85/N82 plaiting kit BGA Plate Nokia N97/N85/N82 plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
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22761 |
BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm stencil for: BGA216 MSM8992 RAM; BGA168 MSM8928 RAM; BGA256 MSM8956 RAM: BGA216 MSM8974RAM; BGA136 MSM8909W RAM; BGA256 MT6797 RAM. |
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17116 |
BGA stencil for iPhone 4 (P3001) BGA stencil for iPhone 4 (P3001) is chip ball template for BGA IC after reballing. |
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17117 |
BGA stencil for iPhone 4S (JP3006) BGA stencil for iPhone 4S (JP3006) is chip ball template for BGA IC after reballing. |
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17118 |
BGA stencil for iPhone 5 (P3012) BGA stencil for iPhone 5 (P3012) is chip ball template for BGA IC after reballing. |
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17119 |
BGA stencil for iPhone 5S (P3025) BGA stencil for iPhone 5S (P3025) is chip ball template for BGA IC after reballing. |
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17120 |
BGA stencil for iPhone 6 (P3031) BGA stencil for iPhone 6 (P3031) is chip ball template for BGA IC after reballing. |
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17121 |
BGA stencil for iPhone 6 Plus (P3030) BGA stencil for iPhone 6 Plus (P3030) is chip ball template for BGA IC after reballing. |
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17122 |
BGA stencil for iPhone 6S (P3039) BGA stencil for iPhone 6S (P3039) is chip ball template for BGA IC after reball. |
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17197 |
BGA stencil for iPhone 6S Plus (P3040) BGA stencil for iPhone 6S Plus (P3040) is chip ball template for BGA IC after rebel. |
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21742 |
BGA stencil for Samsung Galaxy S3 (i9300) BGA stencil for Samsung Galaxy S3 (i9300) plaiting kit it's a BGA stencil matrix needed when you have to exchange BGA parts of your phone and wan't to apply BGA balls into IC. |
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21743 |
BGA stencil for Samsung Galaxy S4 (i9500) BGA stencil for Samsung Galaxy S4 (i9500) plaiting kit it's a BGA stencil matrix needed when you have to exchange BGA parts of your phone and wan't to apply BGA balls into IC. |
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