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Stencil BGA kit
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22182 |
BGA stencils MT6582 / MT6592 0.12mm BGA stencils MT6582 / MT6592 0.12mm |
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22180 |
BGA stencils MT6589 0.12mm |
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22177 |
BGA stencils MT6595 0.12mm |
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22186 |
BGA stencils MT8974 / 8274 / 8674 CPU (MI:2) 0.12mm BGA stencils MT8974 / 8274 / 8674 CPU (MI:2) 0.12mm |
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22174 |
BGA stencilsfor MT7 / MTS / P8 (HW: 1) BGA stencils for MT7 / MTS / P8 (HW: 1) allow reballing 2 CPU models: HI3630, AI3635 as well as ICs found on the Huawei MT7 / MTS / P8 phone |
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1872 |
BGA TWTK-BGAP-10 plaiting kit it's a 11 set matrix for that's needed tool when you have to exchange BGA parts of your phone. It's supports Samsung S308 CPU, N188/N288 CPU, V200 CPU, E800 CPU, X600 Power IC, S300 UEM, E700 Power IC, E708 Flash, E630 CPU and E700 CPU chipsets. Click to link for bigger photo - LINK |
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1871 |
BGA TWTK-BGAP-11 plaiting kit it's a 11 set matrix for that's needed tool when you have to exchange BGA parts of your phone. It's supports Samsung E708, E808, D508 and D500 chipsets. Click to link for bigger photo - LINK |
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1873 |
BGA TWTK-BGAP-24 plaiting kit it's a 24 set matrix for that's needed tool when you have to exchange BGA parts of your phone. It's supports Motorola and Smasung chips as V600 UEM, E680 Flash, V66 Flash, A760 CPU, E680 CPU, V66/V60 CPU, E680 Flash Fan, 998/V66/V70 IC, V70, L2000/998+ Flash, L2000/998 MF/UEM, T2688 MF, 923/998 or T18/T28 IC, V70 MF, T191/998 UEM, V300 CPU, V300 Flash, V300 UEM, A760 RAM, 998 BM, 928 CPU, A760 UEM and A70 Flash. Click to link for bigger photo - LINK |
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1792 |
BGA TWTK-BGAP-A7 plaiting kit it's a 9 set matrix for that's needed tool when you have to exchange BGA parts of your phone. It's supports A768 FLash, K700 UEM, A768 RAM, K700 Y/P/N, K700 Flash, E680 UEM, A768 UEM, K700 CPU |
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1793 |
BGA TWTK-BGAP-A7 plaiting kit it's a 10 set matrix for that's needed tool when you have to exchange BGA parts of your phone. It's supports 6230 MF, 7610 CPU, 6230/6230I CPU, 6020/7260/3220 CPU, 6230/3220/7210 UEM, 6230/3220/7260 MF, Blue Earphone, 6230/6230i CPU and 7610 CPU |
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8698 |
BGAP for HTC new model - ud a00 plaiting kit BGAP for HTC new model - ud a00 plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
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8701 |
BGAP for iPhone 4S plaiting kit BGAP for iPhone 4S plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
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7510 |
BGAP for IPhone/ Iphone 3G/ Iphone 3GS plaiting kit BGAP for IPhone/ Iphone 3G/ Iphone 3GS plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
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7511 |
BGAP for SonyEricsson PDA plaiting kit BGAP for SonyEricsson PDA plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
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22029 |
Direct BGA 9in1 stencils for BGA 136/152/272/63/132/100/316 and LGA 60/52 Direct BGA 9in1 stencils for BGA 136/152/272/63/132/100/316 and LGA 60/52 stencils are used for rebailing BGA memory found in phones and tablets, pendrive, CF cards as well as SSD drives. |
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22028 |
eMMC/eMCP 153 162 169 186 221 254 6in1 eMMC/eMCP 153 162 169 186 221 254 6in1 stencils are used for rebailing BGA memory found in phones and tablets. |
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22576 |
MaAnt Face Lattice Dot Matrix Repair Fixture MR-01 MaAnt Face Lattice Dot Matrix Repair Fixture MR-01 It enables precise placement of elements and their exact positioning by removing surfaces with a point matrix - sieves - and a platform for filling the tin. Support: iPhone X/XS MAX/XR/11/11Pro MAX. |
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22593 |
MaAnt Face Lattice Dot Matrix Repair Fixture MR-01 v2.0 MaAnt Face Lattice Dot Matrix Repair Fixture MR-01 v2.0 support models: iPhone X/XS MAX/XR/11/11Pro MAX. Facilitating the repair of Face ID / Dot Matrix in phones. It enables precise application of paste and planting of elements through the use of a matrix and a special platform. High temperature resistant. Three movable clamps securely hold the element and a spring-loaded side clamp. |
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22170 |
MTK CPU BGA stencils (MU: 2) 0.12mm MTK CPU BGA stencils (MU: 2) 0.12mm allow reballing of 6 models: MT6582, MT6735, MT6589, MT6572A, MT6580, MT6755. |
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22522 |
Platform BGA QianLi iP-01 Middle Frame Reballing for iPhone X /iPhone Xs /iPhone Xs MAX Platform BGA QianLi iP-01 Middle Frame Reballing for iPhone X /iPhone Xs /iPhone Xs MAX this device is a specialist tool that gives the user the ability to reball (re-solder) the middle layer of logic boards on some iPhone Models. It holds the logic board perfectly in place and is heat resistant allowing the user to use a hot air gun and the included stencil to reball the middle layer of the logic board. |
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