Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > Stencil for A7 CPU - QianLi ToolPlus 2D iBlack
|
Stencil for A7 CPU - QianLi ToolPlus 2D iBlack
- Weight: 0.04 kg
- Brand: QianLi
- Type: 2D IC Reballing Stencil
- Compatible Model: for A7 CPU
- Material: Steel
- Colour: Black
- Country/Region of Manufacture: China
- Unit Quantity: 1
- Design/Finish: Matte
|
NEGOTIATE PRICE
You might also be interested in:
+ |
BGA stencils MT6582 / MT6592 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+ |
BGA stencils for Maxim MAX Power (MAX: 1) 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+ |
AMAOE BGA Mbga-U40 stencil reballing BGA RAM496 0,12mm for MBGA-B15
more
|
Price:
7.00 EUR w/o VAT |
+ |
eMMC/eMCP 153 162 169 186 221 254 6in1
more
|
Price:
15.00 EUR w/o VAT |
+ |
MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2
more
|
Price:
9.00 EUR w/o VAT |
+ |
TWTK-BGAP-VIP88 MTK plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+ |
AMAOE BGA Mbga-U32 stencil reballing BGA A14/A15CPU 0,12mm for MBGA-B12
more
|
Price:
7.00 EUR w/o VAT |
+ |
Reballing Kit Jovy - JV-RMS
more
|
Price:
359.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.