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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA Stencil for Samsung Exynos 7880 / 8895B/ 9810/ 3475/ 7580/ 8895A/ 3470/ 7570 CPU-012mm
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BGA Stencil for Samsung Exynos 7880 / 8895B/ 9810/ 3475/ 7580/ 8895A/ 3470/ 7570 CPU-012mm
BGA Stencil for Samsung Exynos 7880 / 8895B/ 9810/ 3475/ 7580/ 8895A/ 3470/ 7570 CPU-012mm - the stencil can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Durable in use. High success rate of planting tin.
- Samsung Exynos 7880
- Samsung Exynos 8895B
- Samsung Exynos 9810
- Samsung Exynos 3475
- Samsung Exynos 7580
- Samsung Exynos 8895A
- Samsung Exynos 3470
- Samsung Exynos 7570
- Place of Origin: China
- Model Number: Black Reballing Stencil
- Material: Steel
- Usage: Reballing
- Color: silver
- Weight: 25g
- Operating Temperature: -50~500C
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NEGOTIATE PRICE
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
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