 |
New products in section Repair Equipment
Browse
Gallery
22890 |
The soldering tip cleaner is an effective method of quickly cleaning soldering tips without heat loss. The entire cleaning process is done using low abrasion brass, minimizing thermal fluctuations compared to using a wet sponge and reducing the oxidation of the tip surface. It has a stainless steel housing, resistant to high temperatures. |
 |
|
22882 |
USB cable (D+, D-, 5V, GND) with 4mm banana connectors (VR70/73M) USB cable (D+, D-, 5V, GND) with 4mm banana connectors (VR70/73M) is an additional cable for VR-Table that allows you to easily connect any device requiring USB transmission to a computer via VR-Table (D=, D-, 5V, GND). Thanks to the use of banana connectors, it is possible to combine signals, e.g. in order to additionally connect an oscilloscope / logic analyzer. To use with VR70/73M probes. |
|
|
|
22881 |
ISP S2 adapter for MiPi Tester UFS/eMMC ISP S2 adapter for MiPi Tester UFS/eMMC allows you to service any device with ISP pinouts via UFS/eMMC interface. Intended for MiPi Box. |
|
|
|
22878 |
MBRT Lite Box for MacBook Battery Repair (supports models from 2009 to 2022) MBRT Lite Box for MacBook Battery Repair (supports models from 2009 to 2022) - Intended for restoring deeply discharged MacBook batteries that won`t charge. Fixes the "Service Recommended" warning. Suitable for MacBook models from 2009 to 2022. MBRT will help you to bring back to life Mac batteries that won`t charge. The entire procedure takes no more than 15 minutes. |
|
|
|
22874 |
Lead-free tin with flux Sn99.3Cu0.7 0.50 100g Lead-free tin with flux Sn99.3Cu0.7 0.50 100g produced in the first smelting of tin and copper in accordance with PN EN 29453-24. A popular soft solder, intended as a low-cost replacement for tin-lead binders. |
|
|
|
22866 |
Mijing T22 MAX double adjustable service holder for fixing PCB boards Mijing T22 MAX double adjustable service holder for fixing PCB boards is a tool for fixing the electronic PCB board that facilitates repair during micro-soldering. The adjustment allows the installation of plates of various shapes, keeping them stable in a given place. Profiled clamps ensure stable fastening of the boards. |
|
|
|
22858 |
Barlow Lens the Delta class 0.7X/136MM for the 8050 series Barlow Lens W136 Delta class 0.7X/136MM for the 8050 series allows the working distance to be increased to 136mm on the 8050 microscopes, thus allowing for more comfortable micro-soldering work. The lens is mounted using a thread on the underside of the stereoscopic head. Screwed in from the objective side, changes magnification 0.7X/WD. |
|
|
|
22857 |
QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm a set of gold-plated spacers 0.08/0.10/0.12mm that enable trouble-free connection of motherboards as well as mounting large BGA systems. They solve the problem of the effect of connecting BGA balls, which is the effect of pressure of the BGA system / plate, creating a minimum distance between the board spaces. |
|
|
|
22856 |
Dock flex test adapter for USB-C socket Dock flex test adapter for USB-C socket allows you to easily test the USB-C socket for diagnostic purposes (damaged PM, data bus resistance) using a multimeter or specialized equipment. |
|
|
|
22855 |
Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing designed for removing glue or planting tin. High-quality universal platform containing 43 reballing templates - magnetically attached. Helpful in tinning/de-adhesive of iPhone/Font/Qualcomm/Hisilicon/MediaTek CPU series ICs. |
|
|
|
22852 |
Relife RL-071B 4in1 optical fingerprint calibration Relife RL-071B 4in1 optical fingerprint calibration for solving fingerprint problems on the screen after replacing the mobile phone display. Easy to use, quick calibration and small and portable. |
|
|
|
22850 |
BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611 BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611 reballing stencil, template, matrix for Samsung Exynos RAM chip repair. |
|
|
|
22845 |
MIJING IC SS2 pad cleaning steel sideburns brushes 2pcs. MIJING IC SS2 pad cleaning steel sideburns brushes 2pcs. ultra-fine steel wire bristles, 0.08mm bristles are closely arranged, rigid and flexible, with the characteristics of steel, but can treat each chip gently. |
|
|
|
22844 |
TUBEMATE 2UUL syringe for Flux tube TUBEMATE 2UUL syringe for Flux tube the grip feels comfortable, improve the work efficiency, suitable for soldering Flux, soldering mask etc |
|
|
|
22839 |
HAKKO WICK wire desoldering tape FR150-85 1.50m / 2.5mm HAKKO WICK wire desoldering tape FR150-85 1.50m/2.5mm desoldering wire is used to remove solder after disassembling elements / systems on a surface-mounted printed circuit board (PCB), such as BGA (ball grid array). It is made as a braid of a copper wire free from oil and oxide contamination with a very small diameter. Length: 1.5m Width: 2.5mm |
|
|
|
22838 |
HAKKO WICK wire desoldering tape FR150-86 1.50m / 3.0mm HAKKO WICK wire desoldering tape FR150-86 1.50m / 3.0mm desoldering wire is used to remove solder after disassembling elements / systems on a surface-mounted printed circuit board (PCB), such as BGA (ball grid array). It is made as a braid of a copper wire free from oil and oxide contamination with a very small diameter. Length: 1.5m, Width: 3.0mm |
|
|
|
22837 |
HAKKO WICK wire desoldering tape FR150-83 1.50m / 1,5mm HAKKO WICK wire desoldering tape FR150-83 1.50m / 1,5mm desoldering wire is used to remove solder after disassembling elements / systems on a surface-mounted printed circuit board (PCB), such as BGA (ball grid array). It is made as a braid of a copper wire free from oil and oxide contamination with a very small diameter. Length: 1.5m, Width: 1,5mm |
|
|
|
22836 |
HAKKO WICK wire desoldering tape FR120-03 1.50m / 1.9mm HAKKO WICK wire desoldering tape FR120-03 1.50m / 1.9mm desoldering wire is used to remove solder after disassembling elements / systems on a surface-mounted printed circuit board (PCB), such as BGA (ball grid array). It is made as a braid of a copper wire free from oil and oxide contamination with a very small diameter. Length: 1.5m, Width: 1.9mm |
|
|
|
22835 |
HAKKO WICK wire desoldering tape FR120-01 1.50m / 0.9mm HAKKO WICK wire desoldering tape FR120-01 1.50m / 0.9mm desoldering wire is used to remove solder after disassembling elements / systems on a surface-mounted printed circuit board (PCB), such as BGA (ball grid array). It is made as a braid of a copper wire free from oil and oxide contamination with a very small diameter. Length: 1.5m, Width: 0.9mm |
|
|
|
22830 |
JC B1 Battery Repair Tester for iPhone JC B1 Battery Repair Tester for iPhone allows you to read, backup, edit and display battery data, improve battery healthy status, and clean usage counter. Online/Offline mode supported. Supported Models: iPhone 5S/5C, iPhone 6S/6SP/6P/SE, iPhone 7/7P, iPhone 8/8P, iPhone X/XR/XS/XS MAX. |
|
|
|
