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Main page > Repair Equipment > Chemical products > Solder paste

Soldering / silicon paste

Silicone pastes necessary for the proper operation of temperature sensors, protect against punctures and the negative influence of weather conditions. In addition, it facilitates the heat transfer between the electronic components and the heat sink. It is resistant to many chemicals, acids, salt and carbon dioxide. Perfect for any service of GSM devices, as well as in the electronics industry. We offer silicone pastes available in various capacities.

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Flux MECHANIC UV559 10g
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22343

Flux MECHANIC UV559 10g

Flux MECHANIC UV559 10g flux solder paste is used for both general soldering as well as SMD and BGA soldering. The paste in the form of a paste is easy to apply and wash. Does not leave carbon deposits or dirt. Flux with the addition of a UV component to detect errors when applying the paste by screen printing. ORIGINAL MECHANIC UV559 is a flux with a very good price-quality ratio and a wide range of use.

Available amount: 227
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Price: 3.99 EUR w/o VAT
Flux MECHANIC UV223 10g soldering paste
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22344

Flux MECHANIC UV223 10g soldering paste

Flux MECHANIC UV223 10g soldering paste is used for both general soldering as well as SMD and BGA soldering. The paste in the form of a paste is easy to apply and wash. Does not leave carbon deposits or dirt. ORIGINAL MECHANIC UV223 is a flux with a very good price-quality ratio and a wide range of use.

Available amount: 196
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Price: 3.99 EUR w/o VAT
MECHANIC V4B45 solder paste
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22346

MECHANIC V4B45 solder paste

MECHANIC V4B45 solder paste is a low-temperature Sn42Bi58 solder paste with a melting point of 138 ° C. composition: Sn42 / Bi58 (42% tin, 58% bismuth), lead-free (Lead Free). This is a special type of low-melting solder paste (tin in the form of a paste) intended for soldering electronic components, i.e. SMD, BGA, e.g. in repair processes. Due to the very low melting point of exactly 138 ° C, the use of the paste in this process allows you to perform complex repairs (e.g. placing the CPU on an iPhone) without exposing the other components of the phone to damage that may result from the need to reach 217 ° C in the lead-free soldering process.

Available amount: 1
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Price: 11.99 EUR w/o VAT
Soldering paste 100g
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7112

Soldering paste 100g

Soldering paste 100g Medium-active flux that facilitates soldering of the following elements: copper, silver-plated, zinc-coated and nickel-plated, used in the places where rosin is not sufficient.

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Price: 1.70 EUR w/o VAT
Soldering paste 35g
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7111

Soldering paste 35g

Soldering paste 35g Medium-active flux that facilitates soldering of the following elements: copper, silver-plated, zinc-coated and nickel-plated, used in the places where rosin is not sufficient.

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Price: 0.90 EUR w/o VAT
EASY PRINT Sn62/Pb36/Ag2 20g
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7124

EASY PRINT Sn62/Pb36/Ag2 20g

EASY PRINT Sn62/Pb36/Ag2 20g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

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Price: 9.80 EUR w/o VAT
EASY PRINT Sn62/Pb36/Ag2 40g
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7125

EASY PRINT Sn62/Pb36/Ag2 40g

EASY PRINT Sn62/Pb36/Ag2 40g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

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Price: 14.00 EUR w/o VAT
EASY PRINT Sn62/Pb36/Ag2 8g
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7123

EASY PRINT Sn62/Pb36/Ag2 8g

EASY PRINT Sn62/Pb36/Ag2 8g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

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Price: 3.20 EUR w/o VAT
EASY PRINT Sn96,5/Ag3/Cu0,5 20g
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7127

EASY PRINT Sn96,5/Ag3/Cu0,5 20g

EASY PRINT Sn96,5/Ag3/Cu0,5 20gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

NOTE: Other accessories for service centers you can find in new categories:
Soldering / silicon paste, Technical lubricating oils, Rework solder liquids / gels, Cleaning fluids, Chemicals for ultrasonic cleaners, Rebailing, Soldering BGA balls
(click to go to correct category)

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Price: 10.50 EUR w/o VAT
EASY PRINT Sn96,5/Ag3/Cu0,5 28g
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7126

EASY PRINT Sn96,5/Ag3/Cu0,5 28g

EASY PRINT Sn96,5/Ag3/Cu0,5 28gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

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Price: 3.40 EUR w/o VAT
EASY PRINT Sn96,5/Ag3/Cu0,5 40g
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7128

EASY PRINT Sn96,5/Ag3/Cu0,5 40g

EASY PRINT Sn96,5/Ag3/Cu0,5 40gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

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Price: 14.60 EUR w/o VAT
EASY PRINT Sn96,5/Ag3/Cu0,5 500g
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7994

EASY PRINT Sn96,5/Ag3/Cu0,5 500g

EASY PRINT Sn96,5/Ag3/Cu0,5 500gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

NOTE: Available also other paste:
EASY PRINT Sn96,5/Ag3/Cu0,5 8g, EASY PRINT Sn96,5/Ag3/Cu0,5 40g, EASY PRINT Sn96,5/Ag3/Cu0,5 20g, EASY PRINT Sn62/Pb36/Ag2 8g, EASY PRINT Sn62/Pb36/Ag2 40g, EASY PRINT Sn62/Pb36/Ag2 20g
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Price: 55.00 EUR w/o VAT
Solder paste (flux) KINBO RMA-218 100g
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21356

Solder paste (flux) KINBO RMA-218 100g

Solder paste (flux) KINBO RMA-218 100g is a high quality Japanese flux no-clean designed to repair BGA, SMD, QFP. It has the consistency of a gel for easy application and has a high viscosity without leaving residues.

Available amount: 140
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Price: 11.00 EUR w/o VAT
Solder paste BAKU BK-30G 0,03 kg
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1044

Solder paste BAKU BK-30G 0,03 kg

Solder paste BAKU BK-30G 0,03 kg

Price: 5.95 EUR w/o VAT
Solder paste BAKU BK-5063 0,05 kg
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7012

Solder paste BAKU BK-5063 0,05 kg

Solder paste BAKU BK-5063 0,05 kg

Price: 7.45 EUR w/o VAT
Solder paste Mechanic BGA 0,03 kg
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7013

Solder paste Mechanic BGA 0,03 kg

Solder paste Mechanic BGA 0,03 kg

Price: 5.95 EUR w/o VAT
Soldering Acid - 35ml
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13857

Soldering Acid - 35ml

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Soldering Acid - 35ml a soldering preparation for difficult to solder nickel surfaces. Use for: soldering nickel surfaces (hard to solder).

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Price: 1.10 EUR w/o VAT
Solder paste PPD 0,03 kg
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3607

Solder paste PPD 0,03 kg

Solder paste PPD 0,03 kg

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Price: 5.50 EUR w/o VAT
BEST BST-328 solder paste 50g
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BEST BST-328 solder paste 50g

BEST BST-328 solder paste 50g original Sn63 / Pb37 (with lead content) is "liquid tin", used for soldering small and hard-to-reach SMD components and replacing balls on BGA systems. Especially recommended and often used for GSM applications. It is used for BGAP screens, thanks to which we obtain the desired mapping of soldering fields to BGA circuits in GSM applications. The paste is also very well suited for precoating BGA pads with lead tin.

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Price: 5.99 EUR w/o VAT
Solder paste Omnix, 40g
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7758

Solder paste Omnix, 40g

Solder paste Omnix, 40g it's special paste that will help you to solder SMD, BGA chipset or even SMT elements. Composition: 62Sn/36Pb/2Ag

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Price: 14.00 EUR w/o VAT
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