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Flux AIM NC254 (NO CLEAN)
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Flux AIM NC254 (NO CLEAN) is compatible with lead-free SN62 / SN63 and lead-free lead-free SAC305 / SN100C. The flux through its wide process window is used to apply or replace BGA beads, repair electronic circuits and properly wet all soldered surfaces. Solder joints are bright, smooth and shiny. Excellent soldering results can be obtained either in manual soldering using a hot air soldering station, a repair station or a brazing furnace. It is a no-clean flux, has a gel consistency. Contamination that remains on the surface after the brazing process is transparent and has little effect on the appearance of the finished product. The flux can be removed with soap water or a suitable cleaning agent such as IPA. The flux can be applied with a brush, syringe (dispenser), spatula, printed by a sieve.
Temperature profile:
-maximum temperature rise: 2 ° C / sec.
- thermal stabilization and flux activation: 150 ° C - 175 ° C
-the temperature range of flux operation: 155 ° C - 245 ° C
Temperature profile:
-maximum temperature rise: 2 ° C / sec.
- thermal stabilization and flux activation: 150 ° C - 175 ° C
-the temperature range of flux operation: 155 ° C - 245 ° C
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Note
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