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Main page > Repair Equipment > Soldering Equipment > Soldering paste

Soldering paste

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MECHANIC V4B45 solder paste
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MECHANIC V4B45 solder paste

MECHANIC V4B45 solder paste is a low-temperature Sn42Bi58 solder paste with a melting point of 138 ° C. composition: Sn42 / Bi58 (42% tin, 58% bismuth), lead-free (Lead Free). This is a special type of low-melting solder paste (tin in the form of a paste) intended for soldering electronic components, i.e. SMD, BGA, e.g. in repair processes. Due to the very low melting point of exactly 138 ° C, the use of the paste in this process allows you to perform complex repairs (e.g. placing the CPU on an iPhone) without exposing the other components of the phone to damage that may result from the need to reach 217 ° C in the lead-free soldering process.

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Price: 11.99 EUR w/o VAT
Flux MECHANIC UV559 10g
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Flux MECHANIC UV559 10g

Flux MECHANIC UV559 10g flux solder paste is used for both general soldering as well as SMD and BGA soldering. The paste in the form of a paste is easy to apply and wash. Does not leave carbon deposits or dirt. Flux with the addition of a UV component to detect errors when applying the paste by screen printing. ORIGINAL MECHANIC UV559 is a flux with a very good price-quality ratio and a wide range of use.

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Price: 3.99 EUR w/o VAT
Flux MECHANIC UV223 10g soldering paste
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Flux MECHANIC UV223 10g soldering paste

Flux MECHANIC UV223 10g soldering paste is used for both general soldering as well as SMD and BGA soldering. The paste in the form of a paste is easy to apply and wash. Does not leave carbon deposits or dirt. ORIGINAL MECHANIC UV223 is a flux with a very good price-quality ratio and a wide range of use.

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Price: 3.99 EUR w/o VAT
BEST BST-328 solder paste 50g
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BEST BST-328 solder paste 50g

BEST BST-328 solder paste 50g original Sn63 / Pb37 (with lead content) is "liquid tin", used for soldering small and hard-to-reach SMD components and replacing balls on BGA systems. Especially recommended and often used for GSM applications. It is used for BGAP screens, thanks to which we obtain the desired mapping of soldering fields to BGA circuits in GSM applications. The paste is also very well suited for precoating BGA pads with lead tin.

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Price: 5.99 EUR w/o VAT
EASY PRINT Sn62/Pb36/Ag2 20g
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EASY PRINT Sn62/Pb36/Ag2 20g

EASY PRINT Sn62/Pb36/Ag2 20g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

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Price: 9.80 EUR w/o VAT
EASY PRINT Sn62/Pb36/Ag2 40g
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EASY PRINT Sn62/Pb36/Ag2 40g

EASY PRINT Sn62/Pb36/Ag2 40g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

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Price: 14.00 EUR w/o VAT
EASY PRINT Sn62/Pb36/Ag2 8g
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EASY PRINT Sn62/Pb36/Ag2 8g

EASY PRINT Sn62/Pb36/Ag2 8g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

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Price: 3.20 EUR w/o VAT
EASY PRINT Sn96,5/Ag3/Cu0,5 20g
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EASY PRINT Sn96,5/Ag3/Cu0,5 20g

EASY PRINT Sn96,5/Ag3/Cu0,5 20gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

NOTE: Other accessories for service centers you can find in new categories:
Soldering / silicon paste, Technical lubricating oils, Rework solder liquids / gels, Cleaning fluids, Chemicals for ultrasonic cleaners, Rebailing, Soldering BGA balls
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Price: 10.50 EUR w/o VAT
EASY PRINT Sn96,5/Ag3/Cu0,5 28g
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EASY PRINT Sn96,5/Ag3/Cu0,5 28g

EASY PRINT Sn96,5/Ag3/Cu0,5 28gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

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Price: 3.40 EUR w/o VAT
EASY PRINT Sn96,5/Ag3/Cu0,5 40g
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EASY PRINT Sn96,5/Ag3/Cu0,5 40g

EASY PRINT Sn96,5/Ag3/Cu0,5 40gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

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Price: 14.60 EUR w/o VAT
EASY PRINT Sn96,5/Ag3/Cu0,5 500g
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EASY PRINT Sn96,5/Ag3/Cu0,5 500g

EASY PRINT Sn96,5/Ag3/Cu0,5 500gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

NOTE: Available also other paste:
EASY PRINT Sn96,5/Ag3/Cu0,5 8g, EASY PRINT Sn96,5/Ag3/Cu0,5 40g, EASY PRINT Sn96,5/Ag3/Cu0,5 20g, EASY PRINT Sn62/Pb36/Ag2 8g, EASY PRINT Sn62/Pb36/Ag2 40g, EASY PRINT Sn62/Pb36/Ag2 20g
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Price: 55.00 EUR w/o VAT
Jelly oil - 50ml
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Jelly oil - 50ml

Jelly oil - 50ml

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Price: 1.00 EUR w/o VAT
Low-Melting solder paste Mechanics MCN B80-BS458 - Sn42/Bi58- 60g
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Low-Melting solder paste Mechanics MCN B80-BS458 - Sn42/Bi58- 60g

Low-Melting solder paste Mechanics MCN B80-BS458 - Sn42/Bi58- 60g is a special type of low melting solder paste (tin in the form of paste) designed for soldering SMD / BGA elements in repair processes / data recovery. Thanks to a very low melting point of 138C, it enables complex repairs (eg, inserting a CPU in the iPhone) without exposing the other components of the phone to damage.

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Price: 19.00 EUR w/o VAT
Low-Melting solder paste Mechanics MCN WQ80 - Sn42 / Bi58 + PB- 40g
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Low-Melting solder paste Mechanics MCN WQ80 - Sn42 / Bi58 + PB- 40g

Low-Melting solder paste Mechanics MCN WQ80 - Sn42 / Bi58 + PB- 40g is a special type of low melting solder paste (tin in the form of paste) designed for soldering SMD / BGA elements in repair processes / data recovery. Thanks to a very low melting point of 138C, it enables complex repairs (eg, inserting a CPU in the iPhone) without exposing the other components of the phone to damage.

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Price: 15.00 EUR w/o VAT
Silicon Oil - 100ml
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Silicon Oil - 100ml

Silicon Oil - 100ml

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Price: 2.10 EUR w/o VAT
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