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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit

Stencil BGA kit

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RBX platform set for reballing BGA UFS/eMMc/eMCP
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RBX platform set for reballing BGA UFS/eMMc/eMCP

RBX platform set for reballing BGA UFS/eMMc/eMCPis a complete set for cleaning BGA systems and preparing them for reballing. Easy and fast method of placing solder balls on BGAs. RBX includes a set of sieves enabling quick and easy application of balls to BGA eMMC, eMCP and UFS components. Durable design with TecaForm and aluminum alloy makes it easy to remove excess balls. Perfectly matching the templates to the base guarantees full adhesion of the balls to the systems. RBX has been adapted to work with the Jovy iRework water heater. It optimizes work during the whole reballing process.

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Price: 199.00 EUR w/o VAT
24 stainless paiting ball for making IC Tin ball
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24 stainless paiting ball for making IC Tin ball

24 stainless paiting ball for making IC Tin ball is a needed tool when you have to exchange BGA parts of your phone.

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Price: 10.41 EUR w/o VAT
BGA for iPhone 5 - UD p3012 plaiting kit
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BGA for iPhone 5 - UD p3012 plaiting kit

BGA for iPhone 5 - UD p3012 plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

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Price: 6.00 EUR w/o VAT
BGA for SonyEricsson A2 plaiting kit
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BGA for SonyEricsson A2 plaiting kit

BGA for SonyEricsson A2 plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

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Price: 8.00 EUR w/o VAT
BGA MTK MT / MT Power (MT: 2) 0.12mm stencils
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BGA MTK MT / MT Power (MT: 2) 0.12mm stencils

BGA MTK MT / MT Power (MT: 2) 0.12mm stencils enable reballing: MT6325V, MT6290MA, MT6261MA, MT6322, MT6329, MT6353V, MT6311DP.

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Price: 12.00 EUR w/o VAT
BGA phone reballing system JV-RKC Jovy
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BGA phone reballing system JV-RKC Jovy

BGA phone reballing system JV-RKC Jovy This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.

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Price: 55.00 EUR w/o VAT
BGA Planting Kit for Siemens series x65, x7x
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BGA Planting Kit for Siemens series x65, x7x

BGA Planting Kit for Siemens series x65, x7x it's proffesional stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone. List of supported phones: A70, A75, AX75, C75, CX75, M75, Siemens CX70, Siemens X65 - np. A65, C65, CV65, CT65, CF65, CX6C, CX65, CXV65, S65, SV65, SL65, M65, MV65 and similar...

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Price: 14.00 EUR w/o VAT
BGA Plate Nokia 09 new model plaiting kit
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BGA Plate Nokia 09 new model plaiting kit

BGA Plate Nokia 09 new model plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

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Price: 8.00 EUR w/o VAT
BGA Plate Nokia N97/N85/N82 plaiting kit
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BGA Plate Nokia N97/N85/N82 plaiting kit

BGA Plate Nokia N97/N85/N82 plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

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Price: 8.00 EUR w/o VAT
BGA reballing stencils JV-RMP
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BGA reballing stencils JV-RMP

BGA reballing stencils JV-RMP is set for Sony PlayStation 3 repair. Set includes 3 rework stencils to reball RSX (Reality Synthesizer), CELL/B.E. (Cell Broadband Engine) and EE+GS PS2 (emotion engine & Graphic synthesizer) using BGA balls and 4 rework stencils to reball CXD9208 GP, Si9132CBU, CXP713120 and the flash 06280W019 using the solder paste.

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Price: 79.00 EUR w/o VAT
BGA reballing stencils JV-RMS
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BGA reballing stencils JV-RMS

BGA reballing stencils JV-RMS set of 12 pcs. universal BGA rework stencils for repair of most of the IC types, pitch, sizes, ball matrix and patterns.

NOTE: Also available other accessories JOVY System:
Cobra Light 360, JV-LSU PCB Holder, JV-SSU PCB Holder, Upper Heater Reflector JV-UR44, Upper Heater Reflector JV-UR33, Upper Heater Reflector JV-UR22, BGA reballing stencils JV-RMP
(click on manufacture name to go to correct category)

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Price: 109.00 EUR w/o VAT
BGA stencil for iPhone 4 (P3001)
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BGA stencil for iPhone 4 (P3001)

BGA stencil for iPhone 4 (P3001) is chip ball template for BGA IC after reballing.

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Price: 6.00 EUR w/o VAT
BGA stencil for iPhone 4S (JP3006)
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BGA stencil for iPhone 4S (JP3006)

BGA stencil for iPhone 4S (JP3006) is chip ball template for BGA IC after reballing.

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Price: 6.00 EUR w/o VAT
BGA stencil for iPhone 5 (P3012)
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BGA stencil for iPhone 5 (P3012)

BGA stencil for iPhone 5 (P3012) is chip ball template for BGA IC after reballing.

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Price: 7.00 EUR w/o VAT
BGA stencil for iPhone 5S (P3025)
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BGA stencil for iPhone 5S (P3025)

BGA stencil for iPhone 5S (P3025) is chip ball template for BGA IC after reballing.

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Price: 6.00 EUR w/o VAT
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