Soldering paste

MGChemicals MG8341No Clean flux paste in syringe dispenser 10mlThis is our absolute favourite flux. We find compared to anything else, it lasts the longest, and doesn’t “gum up” from the heat of your soldering iron like so many others. This means less time cleaning flux only to have to apply more. This is a great all-round flux, and is perfect for surface mount, through hole, hand soldering, and IR/hot air rework. MG Chemicals #8341 features a unique mixture of high grade synthetic resin and thixotropic agents designed specifically for use with high temperature lead free and conventional Sn/Pb alloys.

Flux MECHANIC UV223 10g soldering paste is used for both general soldering as well as SMD and BGA soldering. The paste in the form of a paste is easy to apply and wash. Does not leave carbon deposits or dirt. ORIGINAL MECHANIC UV223 is a flux with a very good price-quality ratio and a wide range of use.

EASY PRINT Sn62/Pb36/Ag2 20g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

EASY PRINT Sn62/Pb36/Ag2 8g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

EASY PRINT Sn96,5/Ag3/Cu0,5 28gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

EASY PRINT Sn96,5/Ag3/Cu0,5 500gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

NOTE: Available also other paste:
EASY PRINT Sn96,5/Ag3/Cu0,5 8g, EASY PRINT Sn96,5/Ag3/Cu0,5 40g, EASY PRINT Sn96,5/Ag3/Cu0,5 20g, EASY PRINT Sn62/Pb36/Ag2 8g, EASY PRINT Sn62/Pb36/Ag2 40g, EASY PRINT Sn62/Pb36/Ag2 20g
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MECHANIC V8B45/n42Bi58 low-temperature solder paste 60g is a special type of low-melting solder paste (tin in the form of a paste) designed for soldering electronic components, i.e. SMD, BGA, e.g. in repair processes. Thanks to the very low melting point of exactly 138 ° C, the use of the paste in this process allows you to perform complex repairs (e.g. the CPU processor in the iPhone) without exposing the other components of the phone to damage that may result from the need to reach 217 ° C in the lead-free soldering process.

Silicon Oil - 50ml

Solder paste (flux) KINBO RMA-218 100g is a high quality Japanese flux no-clean designed to repair BGA, SMD, QFP. It has the consistency of a gel for easy application and has a high viscosity without leaving residues.

Soldering Acid - 35ml a soldering preparation for difficult to solder nickel surfaces. Use for: soldering nickel surfaces (hard to solder).