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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > Set of 4 stencil for Direct BGA eMMC / eMCP (153/169, 162, 221, 529)
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Set of 4 stencil for Direct BGA eMMC / eMCP (153/169, 162, 221, 529)
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Set of 4 stencil for Direct BGA eMMC / eMCP (153/169, 162, 221, 529) is a complete set of stencils to rebailing BGA memory eMMC / EMCP chips found in phones and tablets. Set cover 99% phones models available on market.
Specification:
- Material: Stainless steel
- Type of stencils: direct heating
- Supported BGA sockets: 153/169, 162, 221, 529
- eMMC BGA 153/169 and 162 stencil size: 50 x 50mm
- eMMC BGA 221 and 529 stencil size: 55 x 55mm
Application:
- rebelling eMMC and eMCP memory chips after repair / reading (Chip-Off)
Set photo:
Photo of stencils in set:
Movie show recall process and usage of eMMC stencil
Specification:
- Material: Stainless steel
- Type of stencils: direct heating
- Supported BGA sockets: 153/169, 162, 221, 529
- eMMC BGA 153/169 and 162 stencil size: 50 x 50mm
- eMMC BGA 221 and 529 stencil size: 55 x 55mm
Application:
- rebelling eMMC and eMCP memory chips after repair / reading (Chip-Off)
Set photo:
Photo of stencils in set:
Movie show recall process and usage of eMMC stencil
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Set of 4 stencil for Direct BGA eMMC / eMCP (153/169, 162, 221, 529)
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
