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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm
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BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm
BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm
Supported Models:
- BGA216:MSM8992 RAM
- BGA168 MSM8928 RAM,
- BGA256 MSM8956 RAM,
- BGA216 MSM8974RAM,
- BGA136 MSM8909W RAM,
- BGA256 MT6797 RAM
Specification:
- Country of Origin: China
- Name: CPU-0.18MM
- Material: steel
- Purpose: Reballing
- Weight: 25g
- Using Temperature: -50 ~ 500C
- Grey colour
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BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
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