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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X
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MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X
MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X
1. The stepped grooves can quickly adjust the tin sweating location of IC beads.
2. The square hole position makes the tin bead form easier to remove.
3. No matter new or professional, this 4D Reballing Solder is easy to handle.
4. Uniform heating, easy deformation and long service life.
5. The success rate of Stencil Tin is high, and after being started, it is basically formed once.
- semi carving groove
- auto positioning
- design the leakproof of tin
- remove the stencil with planting
Specification:
- Supported phones: Apple iPhone X
- Weight: 0.06 kg
- Manufacturer: MECHANIC
- Size single stencil: 7,6*4,8cm and 4,7*6,7mm
Set contains:
2 pcs of sieves with dimensions: 7.6 * 4.8cm and 4.7 * 6.7mm and a protective packaging
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
