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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA stencil reballing Mbga-U7 for SDM439 MSM8917 RAM556 for Mbga-B5

AMAOE BGA stencil reballing Mbga-U7 for SDM439 MSM8917 RAM556 for Mbga-B5

AMAOE BGA stencil reballing Mbga-U7 for SDM439 MSM8917 RAM556 for Mbga-B5
Price: 7,00 EUR w/o VAT

Quantity

ID: 22979

Product weight: 0.20 kg

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AMAOE BGA stencil reballing Mbga-U7 for SDM439 MSM8917 RAM556 for Mbga-B5 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
 
Technical data:
Brand: AMAOE
Model: Mbga-U7
Supported chips: SDM439 MSM8917 RAM556
THICKNESS: 0.12MM
 
 
 
 
Specification of screens/templates:
  • High-quality, hard steel sheet template
  • Precision laser cut for better alignment
  • High temperature resistant and not easy to deform
  • Processor and ICs are integrated in one template
  • IC numbers are laser marked on the template for reference purposes, making them much easier to find.

 
Contents:
1 pc. - Mbga screen/matrix

 

Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.56 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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