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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-U37 stencil reballing BGA CPU Exynos 1080/9815 Exynos3475 Exynos8890 0,12mm for MBGA-B14
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AMAOE BGA Mbga-U37 stencil reballing BGA CPU Exynos 1080/9815 Exynos3475 Exynos8890 0,12mm for MBGA-B14
AMAOE BGA Mbga-U37 stencil reballing BGA CPU Exynos 1080/9815 Exynos3475 Exynos8890 0,12mm for MBGA-B14 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
Technical data:
Brand: AMAOE
Model: Mbga-U37
Supported chipsBGA CPU Exynos 1080/9815 Exynos3475 Exynos8890
THICKNESS: 0.12MM
Specification of screens/templates:
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
Contents:
1 pc. - Mbga screen/matrix/ stencil
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
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