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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm
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AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm
AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
Technical data:
Brand: AMAOE
Model: Mbga-MY1
Supported chips:BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254
THICKNESS: 0.15MM
Specification of screens/templates:
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
Contents:
1 pc. - Mbga screen/matrix/ stencil
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NEGOTIATE PRICE
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AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
