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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > TWTK-BGAP A Sieries plaiting kit

TWTK-BGAP A Sieries plaiting kit

TWTK-BGAP A Sieries plaiting kit
Price: 8,00 EUR w/o VAT

Quantity

ID: 4295

Product weight: 0.02 kg

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TWTK-BGAP A Sieries plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

Models:
T28/129 CPU,T191/998 CPU,C6688 CPU,C3508 CPU,702A CPU,XIAO YI CPU,928 CPU,CDMA CPU,MSM3100 CPU,V70 FLASH,P800 FLASH,A760 RAM,NEC2100 CPU,V SERIES FLASH,NEC616 FLASH,N188/288 CPU,BF RFGC,E700 CPU,C2588 CPU,8310 UEM,9500 RAM,GDSS CPU,GD90 CPU,6188 CPU,E680 FLASH,E708 FLASH,8210/A188 FLASH,IVB IC,998H FLASH,E700 FLASH,V3 CPU,A768 RAM,T100,GD55 FLASH,MC P20,7650 MF,C3508,320BC38 FLASH VTECH,T191/998/3688 UEM,3210/T1108 FLASH,K700 FLASH,998 MF,V66 FLASH,6788 DSP,7688 FLASH,T2688-MF,V208 IC,V70

Photo of kit:
Product weight: 0.02 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.61 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.