Solder tin

BEST BST-328 solder paste 50g original Sn63 / Pb37 (with lead content) is "liquid tin", used for soldering small and hard-to-reach SMD components and replacing balls on BGA systems. Especially recommended and often used for GSM applications. It is used for BGAP screens, thanks to which we obtain the desired mapping of soldering fields to BGA circuits in GSM applications. The paste is also very well suited for precoating BGA pads with lead tin.

Low-melting lead-freeMechanic XW6 0.6mm/100g - low-temperature, lead-free. Tin alloy with a melting point of 138 ° C. No odor, no smoke, no irritaing odor, non toxic and harmless. Hight conductivity and thermal conductivity, high purity.

Solder S-Sn60Pb40-SW26 (LC60) Q 0.25 100g is solder manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence.

Solder S-Sn60Pb40-SW26 (LC60) Q 0.50 100g is solder manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence.

Solder SAC 0307 S-Sn99Ag03Cu07-1.1.3/0.56 100g is S-Sn99Ag0,3Cu0,7 solder manufactured in the first melt of tin, silver and copper in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. Designed as an economical replacement for the solder alloy Sn63Pb37, consistent with the guidelines of the RoHS Directive. Specially selected trace elements of metals improves dispersed, weld appearance and protect against rapid oxidation during the soldering process.

Low melting tin with flux Sn42Bi58 1.5mm / 100g- low temperature, lead free with flux. Tin alloy with a melting point of 138 ° C.

LOW-FLAVOR TIN Sn42Bi58 138C/1mm/100g- low temperature, lead free with flux. Tin alloy with a melting point of 138 ° C.

Solder S-Sn63Pb37-SW26 (LC63) Q 0.70 100g is manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence.

Solder S-Sn97Cu3-B/T Q 3.00 100g is manufactured in the first melt of tin and copper according to PN EN 29453:24 standard. Designed for soldering at higher temperatures, also for flame soldering and soldering in the solder heaters (soldering pots).

Solder S-Sn99Cu1-1.1.3 Q 0.70 100g manufactured in the first melt of tin and copper according to PN EN 29453:24 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. Popular soft solder, used as a low-cost replacement for lead-tin solders.