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Solder tin
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List
Gallery
22345 |
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22874 |
Lead-free tin with flux Sn99.3Cu0.7 0.50 100g Lead-free tin with flux Sn99.3Cu0.7 0.50 100g produced in the first smelting of tin and copper in accordance with PN EN 29453-24. A popular soft solder, intended as a low-cost replacement for tin-lead binders. |
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22385 |
Low-melting lead-freeMechanic XW5 0.5mm/100g Low-melting (lead-free) Mechanic XW5 0.5mm/100g tin is low-temperature, lead-free tin alloy with a melting point of 138 ° C. No odor, no smoke, no irritaing odor, non toxic and harmless. Hight conductivity and thermal conductivity, high purity. |
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22386 |
Low-melting lead-freeMechanic XW6 0.6mm/100g Low-melting lead-freeMechanic XW6 0.6mm/100g - low-temperature, lead-free. Tin alloy with a melting point of 138 ° C. No odor, no smoke, no irritaing odor, non toxic and harmless. Hight conductivity and thermal conductivity, high purity. |
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21880 |
Quick Chip 1.0 165mm is a low-melting In & Bi brazing alloy which ,elts at 58 ° C. Applying the CHIP QUIK to the outlets, heating them with a solder leads to the formation of a low melting melt on which the SMD integrated circuits make it easy to scratch and remove the circuit from the printed circuit board. |
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8971 |
Solder S-Sn60Pb40-SW26 (LC60) Q 0.25 100g Solder S-Sn60Pb40-SW26 (LC60) Q 0.25 100g is solder manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. |
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8972 |
Solder S-Sn60Pb40-SW26 (LC60) Q 0.38 100g Solder S-Sn60Pb40-SW26 (LC60) Q 0.38 100g is solder manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. |
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8973 |
Solder S-Sn60Pb40-SW26 (LC60) Q 0.50 100g Solder S-Sn60Pb40-SW26 (LC60) Q 0.50 100g is solder manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. |
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8974 |
Solder S-Sn60Pb40-SW26 (LC60) Q 0.70 100g Solder S-Sn60Pb40-SW26 (LC60) Q 0.70 100g is solder manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. |
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8981 |
Solder SAC 0307 S-Sn99Ag03Cu07-1.1.3/0.56 100g Solder SAC 0307 S-Sn99Ag03Cu07-1.1.3/0.56 100g is S-Sn99Ag0,3Cu0,7 solder manufactured in the first melt of tin, silver and copper in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. Designed as an economical replacement for the solder alloy Sn63Pb37, consistent with the guidelines of the RoHS Directive. Specially selected trace elements of metals improves dispersed, weld appearance and protect against rapid oxidation during the soldering process. |
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8970 |
Solder vial S-Sn60Pb40-SW26 Q 1.0 16g Solder vial S-Sn60Pb40-SW26 Q 1.0 16g it's packed core solder wire LC60 SW 26. Ideal in household and for making small corrections. Available 1.0 mm dia. Net weight of one package - 16 g. |
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22393 |
Low melting tin with flux Sn42Bi58 1.5mm/100g Low melting tin with flux Sn42Bi58 1.5mm / 100g- low temperature, lead free with flux. Tin alloy with a melting point of 138 ° C. |
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22394 |
Low melting tin with flux Sn42Bi58 2.0mm/100g Low melting tin with flux Sn42Bi58 2.0mm/100g - low temperature, lead free with flux. Tin alloy with a melting point of 138 ° C. |
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22392 |
LOW-FLAVOR TIN Sn42Bi58 138C/1mm/100g LOW-FLAVOR TIN Sn42Bi58 138C/1mm/100g- low temperature, lead free with flux. Tin alloy with a melting point of 138 ° C. |
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8975 |
Solder S-Sn63Pb37-SW26 (LC63) Q 0.70 100g Solder S-Sn63Pb37-SW26 (LC63) Q 0.70 100g is manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. |
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8978 |
Solder S-Sn97Cu3-B/T Q 2.00 100g Solder S-Sn97Cu3-B/T Q 2.00 100g is manufactured in the first melt of tin and copper according to PN EN 29453:24 standard. Designed for soldering at higher temperatures, also for flame soldering and soldering in the solder heaters (soldering pots). |
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8979 |
Solder S-Sn97Cu3-B/T Q 3.00 100g Solder S-Sn97Cu3-B/T Q 3.00 100g is manufactured in the first melt of tin and copper according to PN EN 29453:24 standard. Designed for soldering at higher temperatures, also for flame soldering and soldering in the solder heaters (soldering pots). |
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8976 |
Solder S-Sn99Cu1-1.1.3 Q 0.56 100g Solder S-Sn99Cu1-1.1.3 Q 0.56 100g manufactured in the first melt of tin and copper according to PN EN 29453:24 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. Popular soft solder, used as a low-cost replacement for lead-tin solders. |
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8977 |
Solder S-Sn99Cu1-1.1.3 Q 0.70 100g Solder S-Sn99Cu1-1.1.3 Q 0.70 100g manufactured in the first melt of tin and copper according to PN EN 29453:24 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. Popular soft solder, used as a low-cost replacement for lead-tin solders. |
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8982 |
Solder SAC 0307 S-Sn99Ag03Cu07-1.1.3/0.70 100g Solder SAC 0307 S-Sn99Ag03Cu07-1.1.3/0.70 100g is S-Sn99Ag0,3Cu0,7 solder manufactured in the first melt of tin, silver and copper in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. Designed as an economical replacement for the solder alloy Sn63Pb37, consistent with the guidelines of the RoHS Directive. Specially selected trace elements of metals improves dispersed, weld appearance and protect against rapid oxidation during the soldering process. |
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