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Main page > Repair Equipment > Soldering Equipment > Solder tin > Solder S-Sn63Pb37-SW26 (LC63) Q 0.70 100g
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Solder S-Sn63Pb37-SW26 (LC63) Q 0.70 100g
Solder S-Sn63Pb37-SW26 (LC63) Q 0.70 100g is manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence.
Chemical characteristics
- Tin contents: 62,5% to 63,5%
- Lead contents: rest
- Tin and lead of first smelting purity: 99,90%
- Max. impurities:
Cu Ag Cd Sb Bi Fe Zn Al As other
0,05% 0,005% 0,002% 0,05% 0,05% 0,02% 0,001% 0,001% 0,03% 0,05%
Physical characteristics
- Spooled wire 100 g
- wire 0.70 mm diameter
- Melting point: eutectic 183°C
- Density: 8,40 g/cm3
- wires 0.25 mm
- Working temperature: 320°C to 400°C
Usage
S-Sn63Pb37 solder is primarily applied in electronic industry, for manufacturing of standard devices and electronic components, bath soldering of printed circuits, electrotechnics and precision soldering in mechanical engineering.
Chemical characteristics
- Tin contents: 62,5% to 63,5%
- Lead contents: rest
- Tin and lead of first smelting purity: 99,90%
- Max. impurities:
Cu Ag Cd Sb Bi Fe Zn Al As other
0,05% 0,005% 0,002% 0,05% 0,05% 0,02% 0,001% 0,001% 0,03% 0,05%
Physical characteristics
- Spooled wire 100 g
- wire 0.70 mm diameter
- Melting point: eutectic 183°C
- Density: 8,40 g/cm3
- wires 0.25 mm
- Working temperature: 320°C to 400°C
Usage
S-Sn63Pb37 solder is primarily applied in electronic industry, for manufacturing of standard devices and electronic components, bath soldering of printed circuits, electrotechnics and precision soldering in mechanical engineering.
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