Techot TH-620 Soldering Station

Techot TH-620 Soldering Station is a professional soldering station designed to replace BGA chip on PCB boards requiring high power heating. Suitable for use with both leaded or lead free tin. Thanks to the programmable profiles and high quality heating elements we have precise control over the process of soldering and thus the effectiveness of repair. High power output makes the TH-620 is the perfect tool for electronic services specializing in the repair of laptops and consoles.



Features:
1. The device has a touch pad and microprocessor control. Monitor displays three graphs of temperature at any time, so that the temperature error can be controlled in range of 3 degrees.
2. Each profile contains 8 sections soldering temperatures. Excellent temperature control system ensures the effectiveness of soldering.
3. Can store from 1 to 50 graphs of parameters simultaneously. It can analyze the graphs and change the settings on the touch panel at any time.
4. There are three independent heating surfaces. The first and second is a hotair, third is a quartz heating element. The first and second heating surfaces can be controlled by many groups and sections of temperature parameters. The top heating element is regulated in each plane while the bottom gives the height adjustable. A third surface heated board a large area, reducing tension and reducing the temperature needed for proper solder element.
5. Carefully selected temperature sensor with high sensitivity K type working in a closed loop in order to accurately determine the top and bottom temperature.
6. After finishing desoldering and soldering, alarm is generated. When the temperature goes out of control, the electric circuit can be automatically cut off by a system of protection against excessively high temperature.
7. Strong transverse fan cools the PCB board automatically after desoldering and soldering, it can prevent the deformation of PCB board and secure the reballing effect.
8. Handle the motherboard is equipped with a V-groove which ensures fast and stable mounting plates and a large range of adjustment
9. The device is designed to work with large motherboards made ​​in the technology of solder both leaded and lead free like. High power and efficient cooling system provides effective operation and shorten the impact of high temperature on the plate to a minimum.
10. Hot air nozzle can freely rotate 360 ​​° with easy movement. By applying a magnetic nozzle mounting technology.
11. Equipped with split vision system for precise tuning of BGA chip using a system of prisms camera and monitor.
12. The automatic lifting system. After the process ends station automatically lifts heating head. During desoldering the old BGA can be programmed so that when lifting the machine head also lifts the same BGA chip.
13. The station has CE, emergency stop as well as double protection against overheating.









Specifications:
Heating power: 4800W
Top heating: Hot air 800W
Bottom heating: Second heater hotair 1200W, the third IR heater 2700W
Power Supply: AC220V±10 50/60Hz
Device dimensions: 640x630x900 mm
Positioning PCB: V gouge for positioning the PCB, adjustable in each direction using a universal external handle
Temperature control, thermocouple - K sensor, high precision measurement, independent of each heating zone.
PCB dimensions: Max 410×370mm Min 65×65 mm
BGA dimensions: Max 80x80 mm Min 1×1 mm
Electronics: temperature control module with high sensitivity, touch screen, PLC Delta driver
Net Weight: 65kg

Set contains:
- Soldering station TH-620
- Four nozzles of the upper heater (28x28mm , 31x31mm,, 38x38mm, 41x41mm)
- Two lower airflow nozzles (35x35mm , 55x55mm)
- Backup heating elements (one for hot air, one panel IR)
- Elements for mounting plates of irregular shapes 6pcs
- The small size of the external temperature sensor
- Set suction cups for gripping BGA 6pcs
- Manual in Polish and English
- 24 months warranty