New products in section GSM products

QianLi iDFU GO For Instant DFU Recovery Mode

Stencil for A7 CPU - QianLi ToolPlus 2D iBlack stencil facilitate mounting the system. They enable faster work and precise rebailing.
The holes are laser cut. The resulting holes are therefore precise and well matched. In addition, the black color makes it easier to distinguish the layout from the template, making it convenient and easy to use.

Stencil for iPhone 5/5s - QianLi 2D iBlack Communication Base Band Module stencil facilitate mounting the system. They enable faster work and precise rebailing.
The holes are laser cut. The resulting holes are therefore precise and well matched. In addition, the black color makes it easier to distinguish the layout from the template, making it convenient and easy to use.

Stencil for A7 CPU - QianLi ToolPlus 3D iBlack - the 3D feature of the Qianli Toolplus stencil makes fixing your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using these stencils. The holes are laser-cut instead of the the industy widely used, but enviromentally demaging cutting with chemical process. The resulting tin holes on the chip are precise and well-aligned. Additionally, black color makes it easy to distinguish the tin from the stencil providing therefore convenient and easy use. These stencils also feature a 3D relief, conceived for holding the chip in place under the stencil. This helps greatly to avoid mistakes by chip movement and make the work of technician easier and more efficient.

Stencil for iPhone 5/5s - QianLi ToolPlus 3D iBlack Power Logic Module - the 3D feature of the Qianli Toolplus stencil makes fixing your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using these stencils.
The holes are laser-cut instead of the the industy widely used, but enviromentally demaging cutting with chemical process. The resulting tin holes on the chip are precise and well-aligned. Additionally, black color makes it easy to distinguish the tin from the stencil providing therefore convenient and easy use. These stencils also feature a 3D relief, conceived for holding the chip in place under the stencil. This helps greatly to avoid mistakes by chip movement and make the work of technician easier and more efficient.

microSD NAND Monolithic MR MP08 adapter (AD5A14F3) is high quality special adapter for microSD cards using NAND protocol without soldering. The MR MP08 adapter is compatible with devices such as Visual NAND Reconstructor VNR (Rusolut), Flash Extractor (Soft Center) and PC3000 Flash (Ace Laboratory). The adapter replaces the need for any soldering to the card for reading and, thanks to unique solutions, it also enables quick XOR extraction or analysis and configuration of other pinouts than originally provided with the adapter using a logic analyzer. Use of the adapter minimizes the risk of card damage by soldering (ie pad breaking) and faster readings in microSD card technology mode using various NAND programmers.

Miracle Xiaomi Tool Pack (Login Edition) - 12 months is a special activation for Non-Miracle Users. This activation allows you to perform Flash, Unlock, Read Info, Remove Mi Account, and many other operations on Xiaomi phones without any other Miracle products (dongles, boxes). Login Edition is intended for the users who DON`T HAVE ANY MIRACLE PRODUCTS (neither box nor dongle). If you have Miracle Key Dongle, Miracle Thunder Dongle or Miracle FRP Dongle then you need Miracle Xiaomi Tool Pack.

Activation HW Tool by MRT Team This software working with Huawei phone flash & bypass frp and huawei id support emui 10 system and this time. Also Support Huawei phone 9.1 9.0 8.2 8.0 downgrade support huawei phone qualcomm hisi mtk cpu mobile phone or PDA.

Medusa Pro II Box - Full is newest most complex and robust solution for servicing memory chips and reviving hard-bricked phones. Every proud owner of Medusa Pro II will enjoy UFS memory support at highest speeds, including ISP connection, increased eMMC productivity and precisely tailored BGA sockets

Medusa Pro II Box - Upgrade is newest most complex and robust solution for servicing memory chips and reviving hard-bricked phones. Every proud owner of Medusa Pro II will enjoy UFS memory support at highest speeds, including ISP connection, increased eMMC productivity and precisely tailored BGA sockets. The Upgrade version is intended for owners of the following devices: Medusa / Medusa Pro Box / Octoplus Pro and does not include eMMC, UFS adapters.