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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencil for Samsung S7 (SM-G930F)

BGA stencil for Samsung S7 (SM-G930F)

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Price: 6,20 EUR w/o VAT

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ID: 21748

Product weight: 0.02 kg

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BGA stencil for Samsung S7 (SM-G930F) plaiting kit it's a BGA stencil matrix needed when you have to exchange BGA parts of your phone and wan't to apply BGA balls into IC.

Product weight: 0.02 kg.

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Delivery time: 14-28 working days from shiping date

Shipping cost: 9.73 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.

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Sito lekko uszkodzone w jednym obszarze (wyglada na uszkodzenie fabryczne) na szczescie chyba ten fragment nie bedzie potrzebmy do naprawy. Sam sklep polecam.

2022-01-31 Kamil z Lodz

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BGA stencil for Samsung S7 (SM-G930F)

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