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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-U36 stencil reballing BGA Exynos 8895-1703 Exynos 7870/7880 7420 0,12mm for MBGA-B14
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AMAOE BGA Mbga-U36 stencil reballing BGA Exynos 8895-1703 Exynos 7870/7880 7420 0,12mm for MBGA-B14
AMAOE BGA Mbga-U36 stencil reballing BGA Exynos 8895-1703 Exynos 7870/7880 7420 0,12mm for MBGA-B14 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
Technical data:
Brand: AMAOE
Model: Mbga-U36
Supported chips:BGA Exynos 8895-1703 Exynos 7870/7880 7420
THICKNESS: 0.12MM
Specification of screens/templates:
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
Contents:
1 pc. - Mbga screen/matrix/ stencil
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
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