|
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencils for Qualcomm CPU (QU: 1) 0.12mm
|
 |
BGA stencils for Qualcomm CPU (QU: 1) 0.12mm
BGA stencils for Qualcomm CPU (QU: 1) 0.12mm allows reballing 3 models: MSM8996B, MSM8976B, MSM8992B, MSM8996A, MSM8976A, MSM8992A.
|
||
NEGOTIATE PRICE
If you are interested in
BGA stencils for Qualcomm CPU (QU: 1) 0.12mm
you will probably want to take a look at following products:
You might also be interested in:
+
|
AMAOE BGA Mbga-U45 stencil reballing BGA CPU A14/A15/A16 0,12mm for MBGA-B12
more
|
Price:
7.00 EUR w/o VAT |
+
|
AMAOE BGA stencil reballing Mbga-U13 MSM8996 MSM8953 1AB, MSM8974 for MBGA-B6
more
|
Price:
7.00 EUR w/o VAT |
+
|
AMAOE BGA stencil reballing Mbga-U3
more
|
Price:
7.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U20 stencil reballing CPU MT6779V MT6732/6752 MT6757V 0,12mm for MBGA-B7
more
|
Price:
7.00 EUR w/o VAT |
+
|
BGA stencil for iPhone 5S (P3025)
more
|
Price:
6.00 EUR w/o VAT |
+
|
TWTK-BGAP-Nokia universal plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U17 stencil reballing Mbga-U17 SM7125 MT6595 MT6763v 0,12mm for MBGA-B6
more
|
Price:
7.00 EUR w/o VAT |
+
|
BGAP for HTC new model - ud a00 plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
