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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencils for Qualcomm CPU (QU: 1) 0.12mm

BGA stencils for Qualcomm CPU (QU: 1) 0.12mm

BGA stencils for Qualcomm CPU (QU: 1) 0.12mm
Price: 12,00 EUR w/o VAT

Quantity

ID: 22176

Product weight: 0.01 kg

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BGA stencils for Qualcomm CPU (QU: 1) 0.12mm allows reballing 3 models: MSM8996B, MSM8976B, MSM8992B, MSM8996A, MSM8976A, MSM8992A.

Product weight: 0.01 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.59 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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