|
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencils for Qualcomm CPU (QU: 1) 0.12mm
|
 |
BGA stencils for Qualcomm CPU (QU: 1) 0.12mm
BGA stencils for Qualcomm CPU (QU: 1) 0.12mm allows reballing 3 models: MSM8996B, MSM8976B, MSM8992B, MSM8996A, MSM8976A, MSM8992A.
|
||
NEGOTIATE PRICE
If you are interested in
BGA stencils for Qualcomm CPU (QU: 1) 0.12mm
you will probably want to take a look at following products:
You might also be interested in:
+
|
MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X
more
|
Price:
18.00 EUR w/o VAT |
+
|
WL BGA stencils for iPhone 5 5C 5S
more
|
Price:
49.00 EUR w/o VAT |
+
|
MEGA- IDEA Black Stencils Qualcom PM Power
more
|
Price:
9.00 EUR w/o VAT |
+
|
TWTK-BGAP C plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U29 stencil reballing CPU HI6280 HI6250 HI9500v1 0,12mm for MBGA-B10
more
|
Price:
7.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils MSM8953 8917 CPU for Redmi Note 4X|Redmi4|4A |5A|5Plus|S2 |Pro|MI5X|MAX 2
more
|
Price:
9.00 EUR w/o VAT |
+
|
Stencil for Universal Hard Disc Module GTR100 - QianLi ToolPlus 2D iBlack
more
|
Price:
5.00 EUR w/o VAT |
+
|
BGA Planting Kit for Siemens series x65, x7x
more
|
Price:
14.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
