Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencils for MSM8974 0.12mm
|
BGA stencils for MSM8974 0.12mm
|
NEGOTIATE PRICE
You might also be interested in:
+ |
24 stainless paiting ball for making IC Tin ball
more
|
Price:
10.41 EUR w/o VAT |
+ |
MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2
more
|
Price:
9.00 EUR w/o VAT |
+ |
TWTK-BGAP-Nokia universal plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+ |
MEGA-IDEA Black Stencils MSM8998 CPU For MI6 Series | MIX 2
more
|
Price:
9.00 EUR w/o VAT |
+ |
BGA stencils MSM8953 1AB 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+ |
MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9
more
|
Price:
9.00 EUR w/o VAT |
+ |
TWTK-BGAP B plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+ |
BGA stencil for Samsung Galaxy S3 (i9300)
more
|
Price:
6.20 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.