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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2

MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2

MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2
Price: 9,00 EUR w/o VAT

Quantity

ID: 22471

Product weight: 0.20 kg

MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI 8 | MIX 2 - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full.
Proffesional builder of black reballing stencils.  great ordinarity. economic but functional. With multiple polish and test, all series of reballing tools for apple and adroid phone chips finally come out.
 
Compatible Models:
  • XIAOMI MI 8 
  • XIAOMI MI MIX 2
 
Specyfication:
  • Place of Origin: China
  • Brand Name: Mega Idea
  • Model Number: Black Reballing Stencil
  • Material: Steel
  • Usage: Reballing
  • Color: Black
  • Weight: 25g
  • Type: Black Stencil Series (For Android)
  • Operating Temperature: -50~500C

 

 

 

 

Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 10-15 working days from shiping date
Shipping cost: 6.32 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.