4,8 RATING:
Purchase satisfaction
94,7%
Customer service
94,0%
Shop offer
92,7%

Cart

0 products
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA Black Stencils MSM8996 CPU for XIAOMI 5,5S,5sPlus,Note2,MIX

MEGA-IDEA Black Stencils MSM8996 CPU for XIAOMI 5,5S,5sPlus,Note2,MIX

MEGA-IDEA Black Stencils MSM8996 CPU for XIAOMI 5,5S,5sPlus,Note2,MIX
Price: 9,00 EUR w/o VAT

Quantity

ID: 22472

Product weight: 0.10 kg

Add to store products

Ask for product

MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI 8 | MIX 2 - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full.
Proffesional builder of black reballing stencils.  great ordinarity. economic but functional. With multiple polish and test, all series of reballing tools for apple and adroid phone chips finally come out.
 
Compatible Models:
  • Xiaomi Mi 5
  • Xiaomi Mi 5s
  • Xiaomi Mi 5s Plus 
  • Xiaomi Redmi Note 2 
  • Xiaomi Mi Mix
 
Specyfication:
  • Place of Origin: China
  • Brand Name: Mega Idea
  • Model Number: Black Reballing Stencil
  • Material: Steel
  • Usage: Reballing
  • Color: Black
  • Weight: 25g
  • Type: Black Stencil Series (For Android)
  • Operating Temperature: -50~500C

 

 

 

 

 

 

 

  • Kolor: Black
  • Kolor: Black
Product weight: 0.10 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.75 EUR

NEGOTIATE PRICE

PDF
If you are interested in MEGA-IDEA Black Stencils MSM8996 CPU for XIAOMI 5,5S,5sPlus,Note2,MIX you will probably want to take a look at following products:

You might also be interested in:

BGA stencil for iPhone 6 (P3031) + BGA stencil for iPhone 6 (P3031) more
Price:
7.00 EUR w/o VAT
BGA for SonyEricsson A2 plaiting kit + BGA for SonyEricsson A2 plaiting kit more
Price:
8.00 EUR w/o VAT
WL BGA stencils for iPhone 7 7+ + WL BGA stencils for iPhone 7 7+ more
Price:
49.00 EUR w/o VAT
AMAOE BGA Mbga-U27 stencil reballing BGA CPU HI3690v2 HI6290/6290L HI36A0v 0,12mm for MBGA-B9 + AMAOE BGA Mbga-U27 stencil reballing BGA CPU HI3690v2 HI6290/6290L HI36A0v 0,12mm for MBGA-B9 more
Price:
7.00 EUR w/o VAT
BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm + BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm more
Price:
12.00 EUR w/o VAT
MaAnt Face Lattice  Dot Matrix Repair Fixture MR-01 v2.0 + MaAnt Face Lattice Dot Matrix Repair Fixture MR-01 v2.0 more
Price:
29.00 EUR w/o VAT
AMAOE BGA Mbga-U39 stencil reballing BGA SM8250 002 0,12mm for MBGA-B15 + AMAOE BGA Mbga-U39 stencil reballing BGA SM8250 002 0,12mm for MBGA-B15 more
Price:
7.00 EUR w/o VAT
MEGA-IDEA Black Stencils Qualcom CPU MSM8998 A B | MSM8953 1AB B01 | MSM8916 |MSM8937 + MEGA-IDEA Black Stencils Qualcom CPU MSM8998 A B | MSM8953 1AB B01 | MSM8916 |MSM8937 more
Price:
9.00 EUR w/o VAT

Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.