4,8 RATING:
Purchase satisfaction
94,7%
Customer service
94,0%
Shop offer
92,8%

Cart

0 products
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-U18 stencil reballing CPU MT6771V 0,12mm for MBGA-B6

AMAOE BGA Mbga-U18 stencil reballing CPU MT6771V 0,12mm for MBGA-B6

AMAOE BGA Mbga-U18 stencil reballing CPU MT6771V 0,12mm for MBGA-B6
Price: 7,00 EUR w/o VAT

Quantity

ID: 23000

Product weight: 0.20 kg

Add to store products

Ask for product

AMAOE BGA Mbga-U18 stencil reballing CPU MT6771V 0,12mm for MBGA-B6 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
 
Technical data:
Brand: AMAOE
Model: Mbga-U18
Supported chips: CPU MT6771V
THICKNESS: 0.12MM
 
Specification of screens/templates:
  • High-quality, hard steel sheet template
  • Precision laser cut for better alignment
  • High temperature resistant and not easy to deform
  • Processor and ICs are integrated in one template
  • IC numbers are laser marked on the template for reference purposes, making them much easier to find.

 
Contents:
1 pc. - Mbga screen/matrix/ stencil

 

Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.95 EUR

NEGOTIATE PRICE

PDF
If you are interested in AMAOE BGA Mbga-U18 stencil reballing CPU MT6771V 0,12mm for MBGA-B6 you will probably want to take a look at following products:

Dedicated accessories for this product

AMAOE Mbga/MFix-UBase BGA universal reballing platform + AMAOE Mbga/MFix-UBase BGA universal reballing platform more
Price:
33.00 EUR w/o VAT

You might also be interested in:

BGA Plate Nokia 09 new model plaiting kit + BGA Plate Nokia 09 new model plaiting kit more
Price:
8.00 EUR w/o VAT
TWTK-BGAP-55 in 1 Motorola plaiting kit + TWTK-BGAP-55 in 1 Motorola plaiting kit more
Price:
8.00 EUR w/o VAT
MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9 + MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9 more
Price:
9.00 EUR w/o VAT
BGA stencil for iPhone 4S (JP3006) + BGA stencil for iPhone 4S (JP3006) more
Price:
6.00 EUR w/o VAT
TWTK-BGAP-9 in 1 MTK plaiting kit + TWTK-BGAP-9 in 1 MTK plaiting kit more
Price:
8.00 EUR w/o VAT
TWTK-BGAP-41 in 1 Samsung plaiting kit + TWTK-BGAP-41 in 1 Samsung plaiting kit more
Price:
8.00 EUR w/o VAT
AMAOE BGA stencil reballing Mbga-U14 BGA CPU RAM256 RAM366 0.12mm + AMAOE BGA stencil reballing Mbga-U14 BGA CPU RAM256 RAM366 0.12mm more
Price:
7.00 EUR w/o VAT
Direct BGA 9in1 stencils for BGA 136/152/272/63/132/100/316 and LGA 60/52 + Direct BGA 9in1 stencils for BGA 136/152/272/63/132/100/316 and LGA 60/52 more
Price:
25.00 EUR w/o VAT

Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.