Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA Black Stencils SDM 660 CPU for Oppo R11 Series|VIVOX20|MI|NOTE3
|
MEGA-IDEA Black Stencils SDM 660 CPU for Oppo R11 Series|VIVOX20|MI|NOTE3
- HUAWEI P10
- HUAWEI 10 Plus
- HUAWEI Mate 9
- HUAWEI 9 Pro
- HUAWEI nova 2S
- HUAWEI HONOR 9
- HUAWEI V9
- Place of Origin: China
- Brand Name: Mega Idea
- Model Number: Black Reballing Stencil
- Material: Steel
- Usage: Reballing
- Color: Black
- Weight: 25g
- Type: Black Stencil Series (For Android)
- Operating Temperature: -50~500C
|
NEGOTIATE PRICE
You might also be interested in:
+ |
BGA stencils MT6595 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+ |
BGA reballing stencils JV-RMP
more
|
Price:
79.00 EUR w/o VAT |
+ |
AMAOE BGA stencil reballing Mbga-U2
more
|
Price:
7.00 EUR w/o VAT |
+ |
AMAOE BGA Mbga stencil reballing BGA M-SDM845 3in1 0,12mm
more
|
Price:
7.00 EUR w/o VAT |
+ |
BGA Stencil for Samsung Exynos 7885RAM/9820/9610RAM/7885CPU/980/9610CPU-012mm
more
|
Price:
8.00 EUR w/o VAT |
+ |
Complete set of 353 pcs BGA stencils for uBGA 90x90
more
|
Price:
185.00 EUR w/o VAT |
+ |
AMAOE BGA Mbga-U17 stencil reballing Mbga-U17 SM7125 MT6595 MT6763v 0,12mm for MBGA-B6
more
|
Price:
7.00 EUR w/o VAT |
+ |
TWTK-BGAP-18 in 1 MTK plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.