|
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > WL BGA stencils for iPhone 7 7+
|
 |
WL BGA stencils for iPhone 7 7+
WL BGA stencils for iPhone 7 7+ is a professional stencils for IC used in 7 7+ models ie NAND, BB, WiFi, CPU (A10) and RAM. The WL holder has a built-in positioner - just install IC in the base and apply a stencil on it.
|
||
NEGOTIATE PRICE
If you are interested in
WL BGA stencils for iPhone 7 7+
you will probably want to take a look at following products:
You might also be interested in:
+
|
BGA TWTK-BGAP-10 plaiting kit
more
|
Price:
9.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm
more
|
Price:
7.00 EUR w/o VAT |
+
|
24 stainless paiting ball for making IC Tin ball
more
|
Price:
10.41 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils MSM8953 MT6797 CPU For Redmi Note 4 | 4X | Redmi Pro
more
|
Price:
9.00 EUR w/o VAT |
+
|
BGAP for HTC new model - ud a00 plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+
|
Stencil for Universal Hard Disc Module GTR100 - QianLi ToolPlus 2D iBlack
more
|
Price:
5.00 EUR w/o VAT |
+
|
BGA stencils for MTK CPU (MU: 1) 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+
|
Stencil Direct BGA for eMMC 162
more
|
Price:
8.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
