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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > Platform BGA QianLi iP-02 Middle Frame Reballing for iPhone 11 / Phone 11 Pro
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Platform BGA QianLi iP-02 Middle Frame Reballing for iPhone 11 / Phone 11 Pro
Platform BGA QianLi iP-02 Middle Frame Reballing for iPhone 11 / Phone 11 Pro - this device is a specialist tool that gives the user the ability to reball (re-solder) the middle layer of logic boards on some iPhone Models. It holds the logic board perfectly in place and is heat resistant allowing the user to use a hot air gun and the included stencil to reball the middle layer of the logic board.
- This Reballing station is specifically for iPhone 11 / Phone 11 Pro only.
- QianLi
- The main body is made of Steel, which is resistant to high temperature and slow in heat conduction.
- Place logic board from iPhone in the lower section of the plaftorm. Cover with the perfect fit stencil and apply reballing solder paste, remove stencil and apply heat to reball the logic board.
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
