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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm

AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm

Price: 7,00 EUR w/o VAT

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ID: 23151

Product weight: 0.10 kg

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AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

Technical data:

Brand: AMAOE

Model: EMMC: 3 V2.0

Supported chips: A33/A53/A536/A13/A21s/F13/M33

THICKNESS: 0.12MM

Specification of screens/templates:

High-quality, hard steel sheet template
Precision laser cut for better alignment
High temperature resistant and not easy to deform
Processor and ICs are integrated in one template
IC numbers are laser marked on the template for reference purposes, making them much easier to find.

Contents:

1 pc. - Mbga screen/matrix/ stencil

Product weight: 0.10 kg.

Country:

Courier:

Delivery time: 14-28 working days from shiping date

Shipping cost: 9.56 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm

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