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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm
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AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm
AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
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