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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA Stencil for HiSiliconHUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm
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BGA Stencil for HiSiliconHUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm
BGA Stencil for HiSilicon HUAWEI HI6260/HI3680/HI3670/80/90RAM CPU-0,12mm tin planting solder template for Hisilicon Huawei 6260 3670 3680 BGA reballing stencil.
Compatible Models:
- HiSilicon HUAWEI HI6260 v100B
- HiSilicon HUAWEI HI3670 B
- HiSilicon HUAWEI HI3680 B
- HiSilicon HUAWEI HI6260 v100A
- HiSilicon HUAWEI HI6260 v101
- HiSilicon HUAWEI HI3670/80/90RAM
Specyfication:
- Place of Origin: China
- Model Number: HU: 3, v2.0
- Material: Steel
- Usage: Reballing
- Color: silver
- Weight: 25g
- Operating Temperature: -50~500C
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
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