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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm

BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm

BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm
Price: 12,00 EUR w/o VAT

Quantity

ID: 22173

Product weight: 0.01 kg

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BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm allow you to reball 6 models: HI6520, HI3660B, HI6220, HI6250, HI3660A, HI6622.

Product weight: 0.01 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.91 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

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