|
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm
|
 |
BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm
BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm allow you to reball 6 models: HI6520, HI3660B, HI6220, HI6250, HI3660A, HI6622.
|
||
NEGOTIATE PRICE
If you are interested in
BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm
you will probably want to take a look at following products:
You might also be interested in:
+
|
MaAnt Face Lattice Dot Matrix Repair Fixture MR-01
more
|
Price:
25.00 EUR w/o VAT |
+
|
BGA for iPhone 5 - UD p3012 plaiting kit
more
|
Price:
6.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils MSM8916 8939 8940 CPU For OPPO VIVO
more
|
Price:
9.00 EUR w/o VAT |
+
|
BGA stencil for Samsung Galaxy S3 (i9300)
more
|
Price:
6.20 EUR w/o VAT |
+
|
BGA stencils Kirin 950 / 955 / HI3650 CPU (HW:3) 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U17 stencil reballing Mbga-U17 SM7125 MT6595 MT6763v 0,12mm for MBGA-B6
more
|
Price:
7.00 EUR w/o VAT |
+
|
MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X
more
|
Price:
18.00 EUR w/o VAT |
+
|
BGA stencil for iPhone 6 (P3031)
more
|
Price:
7.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
