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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611
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BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611
BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611 reballing stencil, template, matrix for Samsung Exynos RAM chip repair.
- Samsung Exynos RAM 5430
- Samsung Exynos RAM 7884/7885/7904
- Samsung Exynos RAM 9610
- Samsung Exynos RAM 8890
- Samsung Exynos RAM 7870/7880
- Samsung Exynos RAM 9611
- Country of Origin: China
- Name: CPU-0.15MM
- Material: steel
- Purpose: Reballing
- Weight: 25g
- Working temperature: -50~500C
- Grey colour
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