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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE Mbga-U19 sita matryca do reballingu BGA MT6785V MT6735/6737/6753 MT6750/6755 0,12mm dla MBGA-B7
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AMAOE Mbga-U19 sita matryca do reballingu BGA MT6785V MT6735/6737/6753 MT6750/6755 0,12mm dla MBGA-B7
AMAOE Mbga-U19 sita matryca do reballingu BGA MT6785V MT6735/6737/6753 MT6750/6755 0,12mm dla MBGA-B7- the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
Technical data:
Brand: AMAOE
Model: Mbga-U19
Supported chips CPU MT6785V MT6735/6737/6753 MT6750/6755
THICKNESS: 0.12MM
Specification of screens/templates:
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
Contents:
1 pc. - Mbga screen/matrix/ stencil
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
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