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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm

AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm

AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm
Price: 7,00 EUR w/o VAT

Quantity

ID: 23031

Product weight: 0.20 kg

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AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm  the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
 
Technical data:
Brand: AMAOE
Model:  Mbga-MY1
Supported chips:BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254
THICKNESS: 0.15MM
 
Specification of screens/templates:
  • High-quality, hard steel sheet template
  • Precision laser cut for better alignment
  • High temperature resistant and not easy to deform
  • Processor and ICs are integrated in one template
  • IC numbers are laser marked on the template for reference purposes, making them much easier to find.

 

Contents:
1 pc. - Mbga screen/matrix/ stencil

 

Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.67 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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