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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-MY2 IP NAND/PECIC stencil reballing BGA110 BGA60 BGA70 0,15mm

AMAOE BGA Mbga-MY2 IP NAND/PECIC stencil reballing BGA110 BGA60 BGA70 0,15mm

AMAOE BGA Mbga-MY2 IP NAND/PECIC stencil reballing BGA110 BGA60 BGA70 0,15mm
Price: 7,00 EUR w/o VAT

Quantity

ID: 23032

Product weight: 0.20 kg

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AMAOE BGA Mbga-MY2 IP NAND/PECIC stencil reballing BGA110 BGA60 BGA70 0,15mm - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
 
Technical data:
Brand: AMAOE
Model: Mbga-MY2
Supported chips: BGA110 BGA60 BGA70 
THICKNESS: 0.15MM
 
Specification of screens/templates:
  • High-quality, hard steel sheet template
  • Precision laser cut for better alignment
  • High temperature resistant and not easy to deform
  • Processor and ICs are integrated in one template
  • IC numbers are laser marked on the template for reference purposes, making them much easier to find.

 
Contents:
1 pc. - Mbga screen/matrix/ stencil

 

Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.68 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

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