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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-MB1 stencil reballing BGA A14 Wifi Move Board 0,12mm
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AMAOE BGA Mbga-MB1 stencil reballing BGA A14 Wifi Move Board 0,12mm
AMAOE BGA Mbga-MB1 stencil reballing BGA A14 Wifi Move Board 0,12mm- the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
Technical data:
Brand: AMAOE
Model: Mbga-MB1
Supported chips BGA A14 Wifi Move Board
THICKNESS: 0.12MM
Specification of screens/templates:
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
Contents:
1 pc. - Mbga screen/matrix/ stencil
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AMAOE BGA Mbga-MB1 stencil reballing BGA A14 Wifi Move Board 0,12mm
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
