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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm
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BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm
BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm
Supported Models:
- BGA216:MSM8992 RAM
- BGA168 MSM8928 RAM,
- BGA256 MSM8956 RAM,
- BGA216 MSM8974RAM,
- BGA136 MSM8909W RAM,
- BGA256 MT6797 RAM
Specification:
- Country of Origin: China
- Name: CPU-0.18MM
- Material: steel
- Purpose: Reballing
- Weight: 25g
- Using Temperature: -50 ~ 500C
- Grey colour
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BGA Reballing Stencil for BGA RAM.2 CPU UP 0.18mm
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
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