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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm
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AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm
AMAOE SMA:16 V2.0 stencil reballing BGA Exynos 1280-E8825/850-3830 CPU 0,12mm the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
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1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
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