Scotle IR360 PRO V3 2in1 station

Scotle IR360 PRO V3 2in1 station is ideal BGA rework station for PS3 and Xbox 360 game console with larger mainboards and thicker, bigger size BGA chips. It is can be widely used in computer, cell phones, industrial computer, switches, graphics cards, shielding enclosures, CPU's seat, components slot and other large circuit boards with large chips up to 65x65mm repair. It can repair CBGA, CCGA, CSP, QFN, MLF, PGA μBGA For CBGA, CCGA, CSP, QFN, MLF, PGA and all green epoxy and other chip-level μBGAs efficiently and easily.






Main features:

It is with three independent temperature zones, top is dark infrared (you can change it into hot air head easily as you like ), lower is hot air heater and bottom is large infrared pre-heater. It can be easily used in leaded and lead free rework.

It is with infrared ceramic preheating system which can bake damp PCB board and chips independently and its preheating area can be adjusted according to PCB.

High-power cross-flow cooling system to accelerate the preheating zone cooling, to ensure the success rate of continuous desoldering.

Bottom hot air nozzles follow the high-tech rework station is mature design.

Using high-tech temperature control program.

Preheating control is with optimized design to ensure the preheating temperature will not overheat.

Dual LED light design, more convenient to observe the reworking process.

It is 3 in 1 BGA rework station with functions of advanced infrared BGA rework station, traditional hot air bga rework station and ATTEN soldering iron station all in one. (you can use it as you diffirent need, very user friendly.)

Specification:
Total Power: 3450w
Top heating: Hot air 800w or 450W IR Modulus
Bottom heating: Second heater hot air 800w, the third IR heater 2200w
Power supply: AC220V ± 10 50/60Hz
Unit dimensions: 500x420x550 mm
Positioning PCB: Gouging V PCB support adjusted in any direction with external universal holder
Temperature Control: (Sensor K), running closed loop heating independent of each zone.
PCB size Max 370 × 320mm Min 20 × 20 mm
BGA size: 1x1 mm Max Min 80 × 80 mm
Electronics: temperature control module with high sensitivity, communication with PC
Net Weight: 26 kg







Set contains:
1 Main Scotle IR360 BGA rework machine
1 Infrared BGA rework station
1 Tradtional hot air rework station
1 Soldering iron stand
5 pcs hot air nozzles(55x55mm/ 41x41mm/ 38x38mm/ 34x34mm/31x31mm)
1 K-type thermcouples
1 red brush
1 vacuum suction pen with 2 suction pads
1 Manual

Warranty
Producer offers 12 months warranty for this product