 |
Repair Tools - Stencils sets for BGA
Browse
List
Gallery
.jpg)
22289 |
RBX platform set for reballing BGA UFS/eMMc/eMCP RBX platform set for reballing BGA UFS/eMMc/eMCPis a complete set for cleaning BGA systems and preparing them for reballing. Easy and fast method of placing solder balls on BGAs. RBX includes a set of sieves enabling quick and easy application of balls to BGA eMMC, eMCP and UFS components. Durable design with TecaForm and aluminum alloy makes it easy to remove excess balls. Perfectly matching the templates to the base guarantees full adhesion of the balls to the systems. RBX has been adapted to work with the Jovy iRework water heater. It optimizes work during the whole reballing process. |
 |
|
22654 |
QianLi 73 Piece Complete Pack of Reballing Stencils For Phone IC Chip Repair QianLi 73 Piece Complete Pack of Reballing Stencils For Phone IC Chip Repair This complete pack of stencils is ideal for any professional phone repair technician wishing to reball chips from a massive range of phones. Also you save money buying a pack this side, rather than individual stencils. |
|
|
|
22754 |
BAIYI DS-201B Macbook ball planting platform for PMU/SMC/T1/T2/RAM/NAND/WIFI BAIYI DS-201B Macbook ball planting platform for PMU/SMC/T1/T2/RAM/NAND/WIFI is a precise and durable platform / matrix for reballing chips, BGA balls. It is a practical solution that facilitates the work of micro-soldering, where precision is key. |
|
|
|
22857 |
QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm a set of gold-plated spacers 0.08/0.10/0.12mm that enable trouble-free connection of motherboards as well as mounting large BGA systems. They solve the problem of the effect of connecting BGA balls, which is the effect of pressure of the BGA system / plate, creating a minimum distance between the board spaces. |
|
|
|
22855 |
Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing designed for removing glue or planting tin. High-quality universal platform containing 43 reballing templates - magnetically attached. Helpful in tinning/de-adhesive of iPhone/Font/Qualcomm/Hisilicon/MediaTek CPU series ICs. |
|
|
|
6499 |
AOYUE RB910 BGA reballing kit it's proffesional for BGA rework includes re-balling base, 2 mm Allen key ,small spatula, 10 g solder paste, 3 BGA stencils. |
|
|
|
22782 |
BAIYI DS-201A Macbook ball planting platform for CPU/GPU/PCH/BGA BAIYI DS-201A Macbook ball planting platform for CPU/GPU/PCH/BGA is a precise and durable platform / matrix for reballing chips, BGA balls. It is a practical solution that facilitates the work of micro-soldering, where precision is key. |
|
|
|
8131 |
BGA phone reballing system JV-RKC Jovy BGA phone reballing system JV-RKC Jovy This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder. |
|
|
|
9077 |
Complete set of 353 pcs BGA stencils for uBGA 90x90 Complete set of 353 pcs BGA stencils for uBGA 90x90 it's a proffesional set of 353 pcs of 0,3mm stencils 90x90mm for working with CPU, GPU, PS3, Xbox, etc. |
|
|
|
8572 |
Complete set of 353pcs BGA stencils for uBGA + JIG table Complete set of 353 pcs BGA stencils for uBGA + JIG table it's a proffesional set of 353 pcs of 0,3mm stencils 90x90mm for working with CPU, GPU, PS3, Xbox, etc. and proffesional uBGA table that allows to place balls using stencils very easily and without any demage of chip. |
|
|
|
22959 |
Martview RB-01 BGA reballing platform Martview RB-01 +6 stensil rebalancing platform is characterized by high temperature resistance and abrasion resistance. The steel base and resistance to metal fatigue make the product more durable. Easy to clean platform. Silicone pads effectively insulate the temperature, preventing slipping and burns. The double magnet allows for accurate positioning with the mounting plate and holder. The platform supports the Martview RB-01 EMMC EMCP UFS standard BGA153 BGA162 BGA169 BGA186 BGA221 BGA254. |
|
|
|
513 |
Planting kit BTP3 for BGA IC/SMD parts Planting kit BTP3 for BGA IC/SMD parts with solder station, discharge fun and BGA tin ball tools - best tools for enginners in GSM/DCS services. |
|
|
|
15899 |
Large stencil BGA Kit 388 pcs 80x80 79x79 Large stencil BGA Kit 388 pcs 80x80 79x79 with this set possible is place BGA balls on IC chip that you can found in laptops and game consoles. |
|
|
|
.jpg){kind=link}
