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Main page > Repair Equipment > Soldering Equipment > Stencils sets for BGA

Repair Tools - Stencils sets for BGA

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RBX platform set for reballing BGA UFS/eMMc/eMCP
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22289

RBX platform set for reballing BGA UFS/eMMc/eMCP

RBX platform set for reballing BGA UFS/eMMc/eMCPis a complete set for cleaning BGA systems and preparing them for reballing. Easy and fast method of placing solder balls on BGAs. RBX includes a set of sieves enabling quick and easy application of balls to BGA eMMC, eMCP and UFS components. Durable design with TecaForm and aluminum alloy makes it easy to remove excess balls. Perfectly matching the templates to the base guarantees full adhesion of the balls to the systems. RBX has been adapted to work with the Jovy iRework water heater. It optimizes work during the whole reballing process.

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Price: 199.00 EUR w/o VAT
QianLi 73 Piece Complete Pack of Reballing Stencils For Phone IC Chip Repair
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22654

QianLi 73 Piece Complete Pack of Reballing Stencils For Phone IC Chip Repair

QianLi 73 Piece Complete Pack of Reballing Stencils For Phone IC Chip Repair This complete pack of stencils is ideal for any professional phone repair technician wishing to reball chips from a massive range of phones. Also you save money buying a pack this side, rather than individual stencils.

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Price: 259.00 EUR w/o VAT
BAIYI DS-201B Macbook  ball planting platform for PMU/SMC/T1/T2/RAM/NAND/WIFI
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22754

BAIYI DS-201B Macbook ball planting platform for PMU/SMC/T1/T2/RAM/NAND/WIFI

BAIYI DS-201B Macbook ball planting platform for PMU/SMC/T1/T2/RAM/NAND/WIFI is a precise and durable platform / matrix for reballing chips, BGA balls. It is a practical solution that facilitates the work of micro-soldering, where precision is key.

Available amount: 2
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Price: 189.00 EUR w/o VAT
QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm
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22857

QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm

QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm a set of gold-plated spacers 0.08/0.10/0.12mm that enable trouble-free connection of motherboards as well as mounting large BGA systems. They solve the problem of the effect of connecting BGA balls, which is the effect of pressure of the BGA system / plate, creating a minimum distance between the board spaces.

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Price: 32.00 EUR w/o VAT
Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing
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22855

Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing

Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing designed for removing glue or planting tin. High-quality universal platform containing 43 reballing templates - magnetically attached. Helpful in tinning/de-adhesive of iPhone/Font/Qualcomm/Hisilicon/MediaTek CPU series ICs.

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Price: 69.00 EUR w/o VAT
AOYUE RB910 BGA reballing kit
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6499

AOYUE RB910 BGA reballing kit

AOYUE RB910 BGA reballing kit it's proffesional for BGA rework includes re-balling base, 2 mm Allen key ,small spatula, 10 g solder paste, 3 BGA stencils.

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Price: 149.00 EUR w/o VAT
BAIYI DS-201A Macbook  ball planting platform for CPU/GPU/PCH/BGA
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22782

BAIYI DS-201A Macbook ball planting platform for CPU/GPU/PCH/BGA

BAIYI DS-201A Macbook ball planting platform for CPU/GPU/PCH/BGA is a precise and durable platform / matrix for reballing chips, BGA balls. It is a practical solution that facilitates the work of micro-soldering, where precision is key.

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Price: 209.00 EUR w/o VAT
BGA phone reballing system JV-RKC Jovy
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8131

BGA phone reballing system JV-RKC Jovy

BGA phone reballing system JV-RKC Jovy This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.

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Price: 55.00 EUR w/o VAT
Complete set of 353 pcs BGA stencils for uBGA 90x90
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9077

Complete set of 353 pcs BGA stencils for uBGA 90x90

Complete set of 353 pcs BGA stencils for uBGA 90x90 it's a proffesional set of 353 pcs of 0,3mm stencils 90x90mm for working with CPU, GPU, PS3, Xbox, etc.

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Price: 185.00 EUR w/o VAT
Complete set of 353pcs BGA stencils for uBGA + JIG table
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8572

Complete set of 353pcs BGA stencils for uBGA + JIG table

Complete set of 353 pcs BGA stencils for uBGA + JIG table it's a proffesional set of 353 pcs of 0,3mm stencils 90x90mm for working with CPU, GPU, PS3, Xbox, etc. and proffesional uBGA table that allows to place balls using stencils very easily and without any demage of chip.

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Price: 209.00 EUR w/o VAT
Martview RB-01 BGA reballing platform
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22959

Martview RB-01 BGA reballing platform

Martview RB-01 +6 stensil rebalancing platform is characterized by high temperature resistance and abrasion resistance. The steel base and resistance to metal fatigue make the product more durable. Easy to clean platform. Silicone pads effectively insulate the temperature, preventing slipping and burns. The double magnet allows for accurate positioning with the mounting plate and holder. The platform supports the Martview RB-01 EMMC EMCP UFS standard BGA153 BGA162 BGA169 BGA186 BGA221 BGA254.

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Price: 49.00 EUR w/o VAT
Planting kit BTP3 for BGA IC/SMD parts
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513

Planting kit BTP3 for BGA IC/SMD parts

Planting kit BTP3 for BGA IC/SMD parts with solder station, discharge fun and BGA tin ball tools - best tools for enginners in GSM/DCS services.

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Price: 63.54 EUR w/o VAT
Large stencil BGA Kit 388 pcs 80x80 79x79
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15899

Large stencil BGA Kit 388 pcs 80x80 79x79

Large stencil BGA Kit 388 pcs 80x80 79x79 with this set possible is place BGA balls on IC chip that you can found in laptops and game consoles.

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Price: 229.00 EUR w/o VAT