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Main page > Repair Equipment > Soldering Equipment > Stencils sets for BGA > Planting kit BTP3 for BGA IC/SMD parts
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Planting kit BTP3 for BGA IC/SMD parts
Full capacity maintenance tool has the incorporation of such functions as smoke discharge and BGA IC/SMD implanatation. It is an essential tool for engineers who maintain mobile phones. The smoke that is produced by welding is harmful to one's body, and it's causing cough, nausea and dizziness. The discharge smoke fan does less harm to maintenance workers. You may no detect demage fax and fix it.
Package contains:
- 18 position IC modules for SMD, BGA component place tin/soldering ball for mobile phones
- 28 stainless paiting ball for making IC Tin ball
- solderign platform
- discharge smoke fun
- soldering kit
- instruction and warranty
Package contains:
- 18 position IC modules for SMD, BGA component place tin/soldering ball for mobile phones
- 28 stainless paiting ball for making IC Tin ball
- solderign platform
- discharge smoke fun
- soldering kit
- instruction and warranty
Warranty
This product has 12 months warranty.
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
