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Main page > Repair Equipment > Tools and equipment > Other > QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm

QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm

QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm
Price: 32,00 EUR w/o VAT

Quantity

ID: 22857

Product weight: 0.30 kg

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QIANLI iATLAS 24K solder explosion proof 24K Gold planted Foil 0.08/0.10/0.12mm a set of gold-plated spacers 0.08/0.10/0.12mm that enable trouble-free connection of motherboards as well as mounting large BGA systems. They solve the problem of the effect of connecting BGA balls, which is the effect of pressure of the BGA system / plate, creating a minimum distance between the board spaces.
 
Simplifications
+ Efficiency,
+ Success rate only 4 simple steps to complete seal implantation
  • Step 1: Tin stencil filling
  • Step 2: Use tweezers to remove the spacer
  • Step 3: Put the Pad on the Pad
  • Step 4: Melt the tin paste on the washer to fix the gasket and use it

 

 

 

 
 
Packing includes:
  • 0.08mm *1 bottles
  • 0.1mm *1 bottles
  • 0.12mm *1 bottles
Product weight: 0.30 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.59 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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