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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencil for Samsung Galaxy S5 (SM-G900F)

BGA stencil for Samsung Galaxy S5 (SM-G900F)

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BGA stencil for Samsung Galaxy S5 (SM-G900F)
Price: 6,20 EUR w/o VAT

Quantity

ID: 21745

Product weight: 0.02 kg

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BGA stencil for Samsung Galaxy S5 (SM-G900F) plaiting kit it's a BGA stencil matrix needed when you have to exchange BGA parts of your phone and wan't to apply BGA balls into IC.

Product weight: 0.02 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.57 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

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