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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencil for iPhone 6 Plus (P3030)

BGA stencil for iPhone 6 Plus (P3030)

BGA stencil for iPhone 6 Plus (P3030)
Price: 7,00 EUR w/o VAT

Quantity

ID: 17121

Product weight: 0.10 kg

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BGA stencil for iPhone 6 Plus (P3030) is chip ball template for BGA IC after reballing.

Product weight: 0.10 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.72 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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